ME 22,5 OT-1MSTBO TIGY 2201258 PHOENIX CONTACT Upper part, width: 22.5 mm, height: 38.5 mm View larger
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ME 22,5 OT-1MSTBO TIGY 2201258 PHOENIX CONTACT Upper part, width: 22.5 mm, height: 38.5 mm

ME 22,5 OT-1MSTBO TIGY

2201258

PHOENIX_CONTACT

Upper part, width: 22.5 mm, height: 38.5 mm

Upper part of the housing

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Housing (HS)

* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT

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Technical data

Notes
GeneralRefer to the data sheet for the range in the download area.
GeneralMaterial of contact pads for bus connector, galvanic gold (hard gold)

Product properties
Product typeUpper housing part
Product familyME...OT-1MSTBO
Number of positions3
5
Max. number of positions5 (pitch: 3.5 mm)
4 (pitch: 5 mm)
3 (pitch: 7.25 mm)
Number of rows1
TypeUpper housing part for connectors with header
Housing typeDIN rail housing
Ventilation openings presentno

Dimensions
Width22.6 mm
Height99 mm
Depth45.85 mm
Depth from base support surface38.5 mm
PCB design
PCB thickness1.4 mm ... 1.8 mm

Material specifications
Colortitanium gray (7011)
Flammability rating according to UL 94V0
CTI according to IEC 60112600
Housing materialPolyamide

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.15 mm (10 Hz ... 58.1 Hz)
Acceleration2g (58.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Test directionsX-, Y- and Z-axis
Glow-wire test
SpecificationIEC 60695-2-11:2014-02
Temperature850 °C
Time of exposure30 s
Thermal stability / ball thrust test
SpecificationIEC 60695-10-2:2014-02
Temperature125 °C
Test duration1 h
Force20 N
Mechanical strength / tumbling barrel
SpecificationIEC 60998-1:2002-12
Height of fall50 cm
Frequency10
Shocks
SpecificationIEC 60068-2-27:2008-02
Pulse shapeHalf-sine
Acceleration15g
Shock duration11 ms
Number of shocks per direction3
Test directionsX-, Y- and Z-axis (pos. and neg.)
Degree of protection (IP code)
SpecificationIEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08
Ambient conditions
Max. IP code to attainIP20
Ambient temperature (operation)-40 °C ... 105 °C (depending on power dissipation)
Ambient temperature (storage/transport)-40 °C ... 55 °C
Ambient temperature (assembly)-5 °C ... 100 °C
Relative humidity (storage/transport)80 %

PCB data
Number of PCB holders1
Type of PCB mountLatching
Thickness of the PCB1.4 mm ... 1.8 mm

Mounting
Mounting typeLatching with lower housing part
Mounting positionVertical (horizontal DIN rail)

Packaging specifications
Type of packagingpacked in cardboard
Outer packaging typeCarton

Datasheet - PDF

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