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ME 22,5 OT-1MSTBO TIGY
2201258
PHOENIX_CONTACT
1
Housing (HS)
* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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General | Refer to the data sheet for the range in the download area. |
General | Material of contact pads for bus connector, galvanic gold (hard gold) |
Product type | Upper housing part |
Product family | ME...OT-1MSTBO |
Number of positions | 3 |
5 | |
Max. number of positions | 5 (pitch: 3.5 mm) |
4 (pitch: 5 mm) | |
3 (pitch: 7.25 mm) | |
Number of rows | 1 |
Type | Upper housing part for connectors with header |
Housing type | DIN rail housing |
Ventilation openings present | no |
Width | 22.6 mm |
Height | 99 mm |
Depth | 45.85 mm |
Depth from base support surface | 38.5 mm |
PCB design | |
PCB thickness | 1.4 mm ... 1.8 mm |
Color | titanium gray (7011) |
Flammability rating according to UL 94 | V0 |
CTI according to IEC 60112 | 600 |
Housing material | Polyamide |
Vibration test | |
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 150 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
Acceleration | 2g (58.1 Hz ... 150 Hz) |
Test duration per axis | 2.5 h |
Test directions | X-, Y- and Z-axis |
Glow-wire test | |
Specification | IEC 60695-2-11:2014-02 |
Temperature | 850 °C |
Time of exposure | 30 s |
Thermal stability / ball thrust test | |
Specification | IEC 60695-10-2:2014-02 |
Temperature | 125 °C |
Test duration | 1 h |
Force | 20 N |
Mechanical strength / tumbling barrel | |
Specification | IEC 60998-1:2002-12 |
Height of fall | 50 cm |
Frequency | 10 |
Shocks | |
Specification | IEC 60068-2-27:2008-02 |
Pulse shape | Half-sine |
Acceleration | 15g |
Shock duration | 11 ms |
Number of shocks per direction | 3 |
Test directions | X-, Y- and Z-axis (pos. and neg.) |
Degree of protection (IP code) | |
Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
Ambient conditions | |
Max. IP code to attain | IP20 |
Ambient temperature (operation) | -40 °C ... 105 °C (depending on power dissipation) |
Ambient temperature (storage/transport) | -40 °C ... 55 °C |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Relative humidity (storage/transport) | 80 % |
Number of PCB holders | 1 |
Type of PCB mount | Latching |
Thickness of the PCB | 1.4 mm ... 1.8 mm |
Mounting type | Latching with lower housing part |
Mounting position | Vertical (horizontal DIN rail) |
Type of packaging | packed in cardboard |
Outer packaging type | Carton |
Title: | Size: | Type: |
---|---|---|
PDF CATALOG PHOENIX INTERFACE TECHNOLOGY AND SWITCHING DEVICES EN.pdf | 27 Mbytes |
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