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ME 45 UTG GYWH 2707123 PHOENIX CONTACT Electronic housing
ME 45 UTG GYWH
2707123
PHOENIX_CONTACT
Electronic housing
Component housing, Tall design, without vents, width: 45 mm, depth: 99 mm, cross connection: without bus connector, number of positions cross connector: not relevant
Housing (HS)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲More info
▲| General | Refer to the data sheet for the range in the download area. |
| General | Material of contact pads for bus connector, galvanic gold (hard gold) |
| Type | Lower housing parts without vents, housing cover necessary to complete the module |
| Product type | Enclosure bottom part |
| Product family | ME UTG |
| Number of positions | 32 |
| 8 | |
| Type | Tall design |
| Housing type | Component housing |
| Ventilation openings present | no |
| Width | 45 mm |
| Depth | 99 mm |
| Housing material | Polyamide |
| Power dissipation single housing for 20 °C | |
| Ambient temperature | 20 °C |
| Reduction factor | 1 |
| Mounting position | vertical |
| Power dissipation | 7.6 W |
| Power dissipation single housing for 30 °C | |
| Ambient temperature | 30 °C |
| Reduction factor | 0.91 |
| Mounting position | vertical |
| Power dissipation | 6.9 W |
| Power dissipation single housing for 40 °C | |
| Ambient temperature | 40 °C |
| Reduction factor | 0.81 |
| Mounting position | vertical |
| Power dissipation | 6.1 W |
| Power dissipation single housing for 50 °C | |
| Ambient temperature | 50 °C |
| Reduction factor | 0.7 |
| Mounting position | vertical |
| Power dissipation | 5.3 W |
| Power dissipation single housing for 60 °C | |
| Ambient temperature | 60 °C |
| Reduction factor | 0.57 |
| Mounting position | vertical |
| Power dissipation | 4.3 W |
| Power dissipation single housing for 70 °C | |
| Ambient temperature | 70 °C |
| Reduction factor | 0.49 |
| Mounting position | vertical |
| Power dissipation | 3.7 W |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.15 mm (10 Hz ... 58.1 Hz) |
| Acceleration | 2g (58.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-11:2014-02 |
| Temperature | 850 °C |
| Time of exposure | 30 s |
| Thermal stability / ball thrust test | |
| Specification | IEC 60695-10-2:2014-02 |
| Temperature | 125 °C |
| Test duration | 1 h |
| Force | 20 N |
| Mechanical strength / tumbling barrel | |
| Specification | IEC 60998-1:2002-12 |
| Height of fall | 50 cm |
| Frequency | 10 |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Half-sine |
| Acceleration | 15g |
| Shock duration | 11 ms |
| Number of shocks per direction | 3 |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Degree of protection (IP code) | |
| Specification | IEC 60529:1989-11 + AMD 1:1999-11 + AMD 2:2013-08 |
| Ambient conditions | |
| Max. IP code to attain | IP20 |
| Ambient temperature (operation) | -40 °C (depending on power dissipation) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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