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PCH 6/ 4+4-G1L4-7,62 BK
1717137
PHOENIX_CONTACT
50
PCB híbrido de cabeçalho
PCB hybrid header, nominal cross section: 6 mm2, color: black, nominal current: 41 A, 8 A, rated voltage (III/2): 630 V, contact surface: Tin, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: PCH 6/..-G1L4, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, plug-in system: COMBICON PC 6 hybrid, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting: Self-locking flange, type of packaging: packed in cardboard
Conectores PCB
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Product line | COMBICON Connectors L |
Product type | PCB hybrid header |
Product family | PCH 6/..-G1L4 |
Number of positions | 8 |
Pitch | 7.62 mm |
Number of connections | 8 |
Number of rows | 1 |
Mounting flange | Latch mechanism/latching at position 4 |
Number of potentials | 8 |
Pin layout | Linear pinning |
Nominal current IN | 41 A |
Nominal voltage UN | 630 V |
Degree of pollution | 3 |
Rated voltage (III/3) | 630 V |
Rated surge voltage (III/3) | 6 kV |
Rated voltage (III/2) | 630 V |
Rated surge voltage (III/2) | 6 kV |
Rated voltage (II/2) | 1000 V |
Rated surge voltage (II/2) | 6 kV |
Mounting type | Wave soldering |
Pin layout | Linear pinning |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | Tin-plated |
Metal surface contact area (top layer) | Tin (2 - 4 µm Sn) |
Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Metal surface soldering area (top layer) | Tin (2 - 4 µm Sn) |
Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Material data - housing | |
Color () | () |
Insulating material | PA GF |
Insulating material group | I |
CTI according to IEC 60112 | 600 |
Flammability rating according to UL 94 | V0 |
Notes on operation | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
Dimensional drawing | |
Pitch | 7.62 mm |
Width [w] | 47.25 mm |
Height [h] | 19 mm |
Length [l] | 28.2 mm |
Installed height | 16.4 mm |
Solder pin length [P] | 2.6 mm |
Pin dimensions | 1 x 1.2 mm |
PCB design | |
Hole diameter | 1.7 mm |
Air clearances and creepage distances Power | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | I |
Comparative tracking index (IEC 60112) | CTI 600 |
Rated insulation voltage (III/3) | 630 V |
Rated surge voltage (III/3) | 6 kV |
minimum clearance value - non-homogenous field (III/3) | 5.5 mm |
minimum creepage distance (III/3) | 8 mm |
Rated insulation voltage (III/2) | 630 V |
Rated surge voltage (III/2) | 6 kV |
minimum clearance value - non-homogenous field (III/2) | 5.5 mm |
minimum creepage distance (III/2) | 5.5 mm |
Rated insulation voltage (II/2) | 1000 V |
Rated surge voltage (II/2) | 6 kV |
minimum clearance value - non-homogenous field (II/2) | 5.5 mm |
minimum creepage distance (II/2) | 5.5 mm |
Air clearances and creepage distances Signal | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | I |
Comparative tracking index (IEC 60112) | CTI 600 |
Rated insulation voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
minimum creepage distance (III/3) | 2 mm |
Rated insulation voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
minimum creepage distance (III/2) | 1.5 mm |
Rated insulation voltage (II/2) | 320 V |
Rated surge voltage (II/2) | 2.5 kV |
minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
minimum creepage distance (II/2) | 1.6 mm |
Ambient conditions | |
Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Type of packaging | packed in cardboard |
Título: | Tamanho: | Tipo: |
---|---|---|
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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