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SPT-SMD 1,5/10-H-5,0 R72
1376723
PHOENIX_CONTACT
300
Terminal PCB, corrente nominal: 13,5 A, tensão nominal (III/2): 320 V, seção transversal nominal: 1,5 mm², número de linhas: 1, número de postes por fileira: 10, família de artigos: SPT 1,5/.. -H-SMD, passo: 5mm, tipo de conexão: conexão de mola push-in, montagem: solda SMD, direção de conexão do driver/placa de circuito impresso: 90°, cor: preto, arranjo do pino: arranjo linear do pino, número de pinos de solda por potencial: 2, tipo de embalagem: correia de 72mm de largura
PCB terminal block, nominal current: 17.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm2, number of rows: 1, number of positions per row: 10, product range: SPT 1,5/..-H-SMD, pitch: 5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 90 °, color: black, Pin layout: Linear pad geometry, number of solder pins per potential: 2, type of packaging: 72 mm wide tape
Conectores PCB
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Product line | COMBICON Terminals S |
Product type | Printed circuit board terminal |
Product family | SPT 1,5/..-H-SMD |
Number of positions | 10 |
Pitch | 5 mm |
Number of rows | 1 |
Pin layout | Linear pad geometry |
Solder pins per potential | 2 |
Nominal current IN | 17.5 A |
Nominal voltage UN | 320 V |
Degree of pollution | 3 |
Rated voltage (III/3) | 250 V |
Rated surge voltage (III/3) | 4 kV |
Rated voltage (III/2) | 320 V |
Rated surge voltage (III/2) | 4 kV |
Rated voltage (II/2) | 500 V |
Rated surge voltage (II/2) | 4 kV |
Connection technology | |
Nominal cross section | 1.5 mm² |
Conductor connection | |
Connection method | Push-in spring connection |
Conductor cross section rigid | 0.2 mm² ... 1.5 mm² |
Conductor cross section flexible | 0.2 mm² ... 1.5 mm² |
Conductor cross section AWG | 24 ... 16 |
Conductor cross section flexible, with ferrule without plastic sleeve | 0.2 mm² ... 1.5 mm² |
Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.2 mm² ... 0.75 mm² |
Stripping length | 8 mm |
Mounting type | SMD soldering |
Pin layout | Linear pad geometry |
Processing notes | |
Process | Reflow soldering |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 260 °C |
Solder cycles in the reflow | 3 |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | hot-dip tin-plated |
Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
Material data - housing | |
Color (Housing) | black (9005) |
Insulating material | LCP |
Insulating material group | IIIa |
CTI according to IEC 60112 | 175 |
Flammability rating according to UL 94 | V0 |
Material data – actuating element | |
Color (Actuating element) | white (9010) |
Insulating material | PA GF |
Insulating material group | I |
CTI according to IEC 60112 | 600 |
Flammability rating according to UL 94 | V0 |
Assembly instruction: | This item is not suitable for PCB cleaning with liquids. |
Dimensional drawing | |
Pitch | 5 mm |
Width [w] | 49 mm |
Height [h] | 9.7 mm |
Length [l] | 13.6 mm |
Installed height | 7.7 mm |
Pin dimensions | 0.7 x 0.3 mm |
PCB design | |
Pad geometry | 1.6 x 4 mm |
Hole diameter | 1.1 mm |
Connection test | |
Specification | IEC 60998-2-2:2002-12 |
Result | Test passed |
Test for conductor damage and slackening | |
Specification | IEC 60998-2-2:2002-12 |
Result | Test passed |
Pull-out test | |
Specification | IEC 60998-2-2:2002-12 |
Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
0.2 mm² / flexible / > 10 N | |
1.5 mm² / solid / > 40 N | |
1.5 mm² / flexible / > 40 N | |
Flexion test | |
Specification | IEC 60998-2-2:2002-12 |
Result | Test passed |
Insulation holder for crimp connections | |
Result | Test passed |
Temperature-rise test | |
Specification | IEC 60947-7-4:2019-01 |
Requirement temperature-rise test | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
Insulation resistance | |
Specification | IEC 60998-1:2002-12 |
Insulation resistance, neighboring positions | > 5 MΩ |
Air clearances and creepage distances | | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | IIIa |
Comparative tracking index (IEC 60112) | CTI 175 |
Rated insulation voltage (III/3) | 250 V |
Rated surge voltage (III/3) | 4 kV |
minimum clearance value - non-homogenous field (III/3) | 3 mm |
minimum creepage distance (III/3) | 4 mm |
Rated insulation voltage (III/2) | 320 V |
Rated surge voltage (III/2) | 4 kV |
minimum clearance value - non-homogenous field (III/2) | 3 mm |
minimum creepage distance (III/2) | 3.2 mm |
Rated insulation voltage (II/2) | 500 V |
Rated surge voltage (II/2) | 4 kV |
minimum clearance value - non-homogenous field (II/2) | 3 mm |
minimum creepage distance (II/2) | 5 mm |
Vibration test | |
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 150 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
Sweep speed | 5g (60.1 Hz ... 150 Hz) |
Test duration per axis | 2.5 h |
Glow-wire test | |
Specification | IEC 60998-1:2002-12 |
Temperature | 850 °C |
Time of exposure | 5 s |
Ambient conditions | |
Ambient temperature (operation) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Dimensional drawing | |
Type of packaging | 72 mm wide tape |
[W] tape width | 72 mm |
[W2] coil overall dimension | 78.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Transparent-Bag |
ESD level | (D) electrostatically conductive |
Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Título: | Tamanho: | Tipo: |
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PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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