Cart
0
Product
Products
(empty)
No products
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total
View larger
XN-GWBR-MODBUS-TCP 140162 EATON ELECTRIC Gateway for XI/ON I/O system, modbus TCP, bus refresh with
XN-GWBR-MODBUS-TCP
140162
EATON-MOELLER
Gateway for XI/ON I/O system, modbus TCP, bus refresh with
Remote I / O Modules XION
* Brand new product in its original packaging covered by the warranties and certifications provided by EATON-MOELLER
More info
▲Delivery programme
Function | Gateways XI/ON | ||
Function | XN-Gateway with integrated supply | ||
Short Description | supports up to 74 disc-type modules (XN, XNE) 1 x RJ45-socket Address set with decimal rotary coding switch, BootP, DHCP or I/Oassistant Address range: 1 – 254 (dec.) | ||
Field bus connection | Ethernet (Modbus-TCP protocol) | ||
Terminal capacity (field bus/supply voltage) | Screw terminals | ||
Service interface | PS/2 socket | ||
Data transfer rate | 10/100 MBit/s | ||
| Instructions Bus refreshing module is already integrated. | |||
| Information about equipment supplied The delivery package for all gateways includes: 2 x end bracket XN-WEW-32/2-SW, 1 x end plate XN-ABPL | |||
Technical data
| General | |||
Standards | EN 61000-6-2 EN 61000-6-4 EN 61131-2 | ||
Potential isolation | Yes, through optocoupler | ||
Ambient temperature | °C | 0 - +55 | |
Storage | ϑ | °C | -25 - +85 |
Relative humidity | 5 - 95 % (indoor), Level RH-2, no condensation (for storage at 45°C) | ||
Harmful gases | ppm | SO2: 10 (rel. humidity < 75%, no condensation) H2S: 1.0 (rel. humidity < 75 %,no condensation) | |
Vibration | according to IEC/EN 60068-2-6 | ||
Mechanical shock resistance | g | according to IEC 60068-2-27 | |
Continuous shock resistance (IEC/EN 60068-2-29) | According to IEC 60068-2-29 | ||
Drop and topple | According to IEC 60068-2-31, free fall according to IEC 60068-2-32 | ||
Degree of Protection | IP20 | ||
Electromagnetic compatibility (EMC) | |||
ESD | kV | EN 61100-4-2 | |
Electromagnetic fields | V/m | EN 61100-4-2 | |
Burst | EN 61100-4-4 | ||
Surge | EN 61100-4-5 | ||
Radiated RFI | V | EN 61100-4-6 | |
Emitted interference (radiated, high frequency) | dB | EN 55016-2-3 | |
Voltage fluctuations/voltage dips | EN 61131-2 | ||
Type test | to EN 61131-2 | ||
Approvals | CE, cULus | ||
Static heat dissipation, non-current-dependent | Pvs | W | 10 |
Other technical data (sheet catalogue) | >Technical Data | ||
| Terminations | |||
Rated data | according to VDE 0611 Part 1/8.92/IEC/EN 60947-7-1 | ||
Connection design in TOP direction | Spring-loaded/screw terminal | ||
Stripping length | mm | 8 | |
Clamping range | max. 0.5 - 2.5 mm2 | ||
Connectable conductors | |||
Solid | mm2 | 0.5 - 2.5 | |
Flexible without ferrule | mm2 | 0.5 - 1.5 | |
Flexible with ferrule | mm2 | 0.5 - 1.5 | |
Flexible with ferrule | mm2 | 0.5 - 1.5 | |
Gauge pin IEC/EN 60947-1 | A1 | ||
| Networking | |||
Bus | Ethernet | ||
Bus protocol | Modbus-TCP | ||
Maximum station configuration | 74 cards (XN, XNE) of slice design or max. length of station: 1 m | ||
System supply | Usys | V DC | 24 /5 |
Coordination type 2 | Usys | V DC | 4.7…5.3 |
Coordination type 1 | Usys | V DC | 18…30 |
Field voltage | UL | 24 V DC | |
Admissible range | 18-30 V DC | ||
Residual ripple | % | According to EN 61131-2 | |
Service interface | PS/2 socket | ||
Connection design for field bus | RJ45-bus | ||
Data transfer rate | kBit/s | 10000, 100000 | |
Data transfer rate setting | automatic | ||
Addressing | Decimal rotary coding switch, BootP, DHCP or I/Oassistant | ||
Address range | 1 - 254 decimal | ||
Design verification as per IEC/EN 61439(Show features)(Hide features)
Technical data for design verification | |||
Rated operational current for specified heat dissipation | In | A | 0 |
Heat dissipation per pole, current-dependent | Pvid | W | 0 |
Equipment heat dissipation, current-dependent | Pvid | W | 0 |
Static heat dissipation, non-current-dependent | Pvs | W | 10 |
Heat dissipation capacity | Pdiss | W | 0 |
Operating ambient temperature min. | °C | 0 | |
Operating ambient temperature max. | °C | 55 | |
Degree of Protection | IP20 | ||
IEC/EN 61439 design verification | |||
10.2 Strength of materials and parts | |||
10.2.2 Corrosion resistance | Meets the product standard's requirements. | ||
10.2.3.1 Verification of thermal stability of enclosures | Meets the product standard's requirements. | ||
10.2.3.2 Verification of resistance of insulating materials to normal heat | Meets the product standard's requirements. | ||
10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects | Meets the product standard's requirements. | ||
10.2.4 Resistance to ultra-violet (UV) radiation | Meets the product standard's requirements. | ||
10.2.5 Lifting | Does not apply, since the entire switchgear needs to be evaluated. | ||
10.2.6 Mechanical impact | Does not apply, since the entire switchgear needs to be evaluated. | ||
10.2.7 Inscriptions | Meets the product standard's requirements. | ||
10.3 Degree of protection of ASSEMBLIES | Meets the product standard's requirements. | ||
10.4 Clearances and creepage distances | Meets the product standard's requirements. | ||
10.5 Protection against electric shock | Does not apply, since the entire switchgear needs to be evaluated. | ||
10.6 Incorporation of switching devices and components | Does not apply, since the entire switchgear needs to be evaluated. | ||
10.7 Internal electrical circuits and connections | Is the panel builder's responsibility. | ||
10.8 Connections for external conductors | Is the panel builder's responsibility. | ||
10.9 Insulation properties | |||
10.9.2 Power-frequency electric strength | Is the panel builder's responsibility. | ||
10.9.3 Impulse withstand voltage | Is the panel builder's responsibility. | ||
10.9.4 Testing of enclosures made of insulating material | Is the panel builder's responsibility. | ||
10.10 Temperature rise | The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices. | ||
10.11 Short-circuit rating | Is the panel builder's responsibility. | ||
10.12 Electromagnetic compatibility | Is the panel builder's responsibility. | ||
10.13 Mechanical function | The device meets the requirements, provided the information in the instruction leaflet (IL) is observed. |
Reviews (0) ▲
No customer reviews for the moment.
Add Review
hide form
| Rating: |
|
| Name: | |
| Email: | |
| Subject: | |
| Text: | |
| Do you recommend this product to buy? | |
|
|
|
| Add review | |
All ratings we receive from the items we offer are real and verified. A small gesture, but a lot of value. That's why we thank you for that minute you invest in leaving us your opinion and qualification about the products, because it helps us to continue improving and to offer you a service of even higher quality.