ZFK3DS 1,5-5,08- 1 PA0 1787810 PHOENIX CONTACT Borne para placa de circuito impresso Ver maior
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ZFK3DS 1,5-5,08- 1 PA0 1787810 PHOENIX CONTACT Borne para placa de circuito impresso

ZFK3DS 1,5-5,08- 1 PA0

1787810

PHOENIX_CONTACT

Borne para placa de circuito impresso

PCB terminal block, nominal current: 12 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 3, number of rows: 3, number of positions per row: 1, product range: ZFK3DS(A) 1,5, pitch: 5.08 mm, connection method: Spring-cage connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, Pin layout: Linear pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

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Dados técnicos

Product properties
TypePC terminal block can be aligned
Product lineCOMBICON Terminals S
Product typePrinted circuit board terminal
Product familyZFK3DS(A) 1,5
Number of positions1
Pitch5.08 mm
Number of connections3
Number of rows3
Number of potentials3
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties
Nominal current IN12 A
Nominal voltage UN400 V
Degree of pollution3
Rated voltage (III/3)250 V
Rated surge voltage (III/3)4 kV
Rated voltage (III/2)400 V
Rated surge voltage (III/2)4 kV
Rated voltage (II/2)630 V
Rated surge voltage (II/2)4 kV

Connection data
Connection technology
TypePC terminal block can be aligned
Nominal cross section1.5 mm²
Conductor connection
Connection methodSpring-cage connection
Conductor cross section rigid0.2 mm² ... 2.5 mm²
Conductor cross section flexible0.2 mm² ... 1.5 mm²
Conductor cross section AWG24 ... 14
Conductor cross section flexible, with ferrule without plastic sleeve0.25 mm² ... 1.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve0.25 mm² ... 1.5 mm²
Stripping length7.5 mm

Mounting
Mounting typeWave soldering
Pin layoutLinear pinning
Connection methodSpring-cage connection

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicshot-dip tin-plated
Metal surface terminal point (top layer)Tin (10 - 16 µm Sn)
Metal surface soldering area (top layer)Tin (10 - 16 µm Sn)
Material data - housing
Color ()()
Insulating materialPA
Insulating material groupI
CTI according to IEC 60112600
Flammability rating according to UL 94V0
Glow wire flammability index GWFI according to EN 60695-2-12850
Glow wire ignition temperature GWIT according to EN 60695-2-13775
Temperature for the ball pressure test according to EN 60695-10-2125 °C

Dimensions
Dimensional drawinghxwaiuudgf.jpeg
Pitch5.08 mm
Length [l]32.2 mm
Installed height37 mm
Solder pin length [P]3.4 mm
Pin dimensions0.7 x 1 mm
PCB design
Hole diameter1.3 mm

Electrical tests
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupI
Comparative tracking index (IEC 60112)CTI 600
Rated insulation voltage (III/3)250 V
Rated surge voltage (III/3)4 kV
minimum clearance value - non-homogenous field (III/3)3 mm
minimum creepage distance (III/3)3.2 mm
Rated insulation voltage (III/2)400 V
Rated surge voltage (III/2)4 kV
minimum clearance value - non-homogenous field (III/2)3 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)630 V
Rated surge voltage (II/2)4 kV
minimum clearance value - non-homogenous field (II/2)3 mm
minimum creepage distance (II/2)3.2 mm

Environmental and real-life conditions
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Título: Tamanho: Tipo:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 15 Mbytes

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