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MKDSP 10N/ 4-10,16 BD WH:1-4 1774247 PHOENIX CONTACT Borne de placa de circuito impresso
MKDSP 10N/ 4-10,16 BD WH:1-4
1774247
PHOENIX_CONTACT
50
Borne de placa de circuito impresso
Terminal de placa de circuito impresso, atualizado atual: 76 A, tensão de dimensionamento (III/2): 1000 V, seção nominal: 16 mm², Número de potenciais: 4, Número de linhas: 1, Número de postes por linha: 4, família de itens: MKDSP 10N, arremesso: 10,16 mm, tipo de conexão: Conexão de parafuso com cápsula de tração, montagem: Soldagem de onda, Condutor de direção de conexão/placa de circuito impresso: 0°, cor: verde, Arranjo do pino: Arranjo de pinos lineares duplos, comprimento do pino [P]: 5 mm, tipo de embalagem: embalagem em caixa
PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDSP 10N, pitch: 10.16 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard
Conectores PCB
* Produto novo em sua embalagem original com todas as garantias e certificações de PHOENIX_CONTACT
Mais informação
▲| Type | PC terminal block can be aligned |
| Product line | COMBICON Terminals L |
| Product type | Printed circuit board terminal |
| Product family | MKDSP 10N |
| Number of positions | 4 |
| Pitch | 10.16 mm |
| Number of connections | 4 |
| Number of rows | 1 |
| Number of potentials | 4 |
| Pin layout | Linear pinning |
| Solder pins per potential | 2 |
| Nominal current IN | 76 A |
| Nominal voltage UN | 1000 V |
| Degree of pollution | 3 |
| Rated voltage (III/3) | 690 V |
| Rated surge voltage (III/3) | 8 kV |
| Rated voltage (III/2) | 1000 V |
| Rated surge voltage (III/2) | 8 kV |
| Rated voltage (II/2) | 1000 V |
| Rated surge voltage (II/2) | 6 kV |
| Connection technology | |
| Type | PC terminal block can be aligned |
| Nominal cross section | 16 mm² |
| Conductor connection | |
| Connection method | Screw connection with tension sleeve |
| Conductor cross section rigid | 0.5 mm² ... 16 mm² |
| Conductor cross section flexible | 0.5 mm² ... 16 mm² |
| Conductor cross section AWG | 20 ... 6 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.5 mm² ... 16 mm² |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.5 mm² ... 16 mm² |
| 2 conductors with same cross section, solid | 0.5 mm² ... 4 mm² |
| 2 conductors with same cross section, flexible | 0.5 mm² ... 4 mm² |
| 2 conductors with same cross section, flexible, with ferrule without plastic sleeve | 0.5 mm² ... 2.5 mm² |
| 2 conductors with the same cross section, flexible, with TWIN ferrule with plastic sleeve | 0.5 mm² ... 6 mm² |
| Stripping length | 10 mm |
| Tightening torque | 1.2 Nm ... 1.5 Nm |
| Mounting type | Wave soldering |
| Pin layout | Linear pinning |
| Drive form screw head | Slotted (L) |
| Connection method | Screw connection with tension sleeve |
| Drive form screw head | Slotted (L) |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (2 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |  |
| Pitch | 10.16 mm |
| Width [w] | 40.64 mm |
| Height [h] | 34.3 mm |
| Length [l] | 18.4 mm |
| Installed height | 29.3 mm |
| Solder pin length [P] | 5 mm |
| Pin dimensions | 1 x 0.9 mm |
| PCB design | |
| Hole diameter | 1.5 mm |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-1:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-1:2002-12 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.5 mm² / solid / > 20 N |
| 0.5 mm² / flexible / > 20 N | |
| 16 mm² / solid / > 100 N | |
| 16 mm² / flexible / > 100 N | |
| Torque test | |
| Specification | IEC 60998-2-1:2002-12 |
| Temperature-rise test | |
| Specification | IEC 60998-1:2002-12 |
| Requirement temperature-rise test | Increase in temperature ≤ 45 K |
| Insulation resistance | |
| Specification | IEC 60998-1:2002-12 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 690 V |
| Rated surge voltage (III/3) | 8 kV |
| minimum clearance value - non-homogenous field (III/3) | 8 mm |
| minimum creepage distance (III/3) | 8 mm |
| Rated insulation voltage (III/2) | 1000 V |
| Rated surge voltage (III/2) | 8 kV |
| minimum clearance value - non-homogenous field (III/2) | 8 mm |
| minimum creepage distance (III/2) | 8 mm |
| Rated insulation voltage (II/2) | 1000 V |
| Rated surge voltage (II/2) | 6 kV |
| minimum clearance value - non-homogenous field (II/2) | 5.5 mm |
| minimum creepage distance (II/2) | 5.5 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Sweep speed | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Datasheet - PDF
▲| Título: | Tamanho: | Tipo: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
|
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