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MCV 1,5/ 9-GF-3,5 P14 THR 1780079 PHOENIX CONTACT Conector de placa de circuito impresso

MCV 1,5/ 9-GF-3,5 P14 THR

1780079

PHOENIX_CONTACT

50

Conector de placa de circuito impresso

PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 9, number of rows: 1, number of positions: 9, number of connections: 9, product range: MCV 1,5/..-GF-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads

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Dados técnicos
Product properties
Product typePCB headers
Product familyMCV 1,5/..-GF-THR
Product lineCOMBICON Connectors S
TypeComponent suitable for through hole reflow
Number of positions9
Pitch3.5 mm
Number of connections9
Number of rows1
Number of potentials9
Mounting flangeThreaded flange
Pin layoutLinear pinning
Solder pins per potential1
Data management status
Article revision01
Electrical properties
Nominal current IN8 A
Nominal voltage UN160 V
Contact resistance1.2 mΩ
Rated voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV
Mounting
Mounting typeTHR soldering / wave soldering
Pin layoutLinear pinning
Flange
Tightening torque0.3 Nm
Processing notes
ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc260 °C
Solder cycles in the reflow3
Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (1.3 - 3 µm Ni)
Material data - housing
Color ()()
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0
Dimensions
Dimensional drawingdvbtjqggdc.jpg
Pitch3.5 mm
Width [w]41.8 mm
Height [h]10.6 mm
Length [l]6.9 mm
Installed height9.2 mm
Solder pin length [P]1.4 mm
Pin dimensions0.8 x 0.8 mm
PCB design
Hole diameter1.4 mm
Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N		Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles25
Insertion strength per pos. approx.6 N
Withdraw strength per pos. approx.4 N
Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions12
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)2.5 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)250 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)2.5 mm
Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Test directionsX-, Y- and Z-axis
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R11.2 mΩ
Contact resistance R21.3 mΩ
Insertion/withdrawal cycles25
Insulation resistance, neighboring positions> 5 MΩ
Climatic test
SpecificationISO 6988:1985-02
Corrosive stress0.2 dm3SO2on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV
Shocks
SpecificationIEC 60068-2-27:2008-02
Pulse shapeSemi-sinusoidal
Acceleration30g
Shock duration18 ms
Test directionsX-, Y- and Z-axis (pos. and neg.)
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C
Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

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Título: Tamanho: Tipo:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes
PHOENIX CONTACT-1780079-MCV 1,5/ 9-GF-3,5 P14 THR 151 Kbytes PHOENIX CONTACT-1780079-MCV 1,5/ 9-GF-3,5 P14 THR

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