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FP 0,8/ 32-MV 8,65 1154014 PHOENIX CONTACT Tira de faca SMD, corrente nominal: 1,7 A, tensão de teste: 500 V..
FP 0,8/ 32-MV 8,65
1154014
PHOENIX_CONTACT
250
Tira de faca SMD, corrente nominal: 1,7 A, tensão de teste: 500 VAC, número de postes: 32, passo: 0,8 mm, cor: preto, contatos de superfície: ouro, tipo de contato: macho, montagem: solda SMD
SMD male connector, nominal current: 1.7 A, Test voltage: 500 V AC, number of positions: 32, pitch: 0.8 mm, color: black, contact surface: Gold, contact connection type: Pin, mounting: SMD soldering
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* Produto novo em sua embalagem original com todas as garantias e certificações de PHOENIX_CONTACT
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Product properties
| Product type | SMD male connector |
| Product family | FP 0,8/...-MV 8,65 |
| Number of positions | 32 |
| Pitch | 0.8 mm |
| Number of rows | 2 |
| Pin layout | Linear pad geometry |
Electrical properties
| Nominal current IN | 1.7 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.) |
| Degree of pollution | 3 |
| Contact resistance | 25 mΩ |
| Test voltage | 500 V AC IEC 60512-4-1:2003 |
Mounting
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
Material specifications
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Selective coating |
| Metal surface contact area (top layer) | Gold (Au) |
| Metal surface contact area (middle layer) | Nickel (Ni) |
| Metal surface soldering area (top layer) | Tin (Sn) |
| Metal surface soldering area (middle layer) | Nickel (Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIb |
| CTI according to IEC 60112 | 150 |
| Flammability rating according to UL 94 | V0 |
Connection data
| Cross section AWG | (converted acc. to IEC) |
Notes
| Notes on operation | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Details for soldering processes | The items are suitable for assembly on both sides and for overhead soldering. |
Dimensions
| Dimensional drawing |  |
| Pitch | 0.8 mm |
| Width [w] | 16.7 mm |
| Height [h] | 13.75 mm |
| Length [l] | 6.1 mm |
| Installed height | 13.15 mm |
| Application | |
| Contact cover | 0.8 mm |
| Center offset | ± 0.7 mm in longitudinal and transverse direction |
| Stack height | 13.5 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV 4,85) |
| 16.5 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV 7,85) | |
| 19.5 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-FV-SH 10,85) | |
| Wipe length | 1.5 mm |
| Angular tolerance | ± 5 ° in longitudinal and transverse direction (when plugging in) |
| ± 5 ° in longitudinal and transverse direction (when plugged in) | |
| Axial offset in X direction (longitudinal) | ± 0.3 mm (Tolerance compensation when plugged in) |
| Axial offset in Y direction (transversal) | ± 0.3 mm (Tolerance compensation when plugged in) |
| PCB design | |
| Pad geometry | 0.5 x 2.4 mm |
| Hole diameter | 0.75 mm |
Electrical tests
| Thermal test | Test group C | |
| Specification | IEC 60512-5-2:2002-02 |
| Tested number of positions | 80 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Air clearances and creepage distances | | |
| Insulating material group | IIIb |
| Minimum value for clearance and creepage distance | 0.25 mm |
Environmental and real-life conditions
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 2000 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 1.5 mm (10 Hz ... 58 Hz) |
| Sweep speed | 200 m/s² (58 Hz ... 2000 Hz) |
| Test duration per axis | 2.5 h |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 (following) |
| Contact resistance R1 | 25 mΩ |
| Contact resistance R2 | 25 mΩ |
| Insertion/withdrawal cycles | 500 |
| Insulation resistance, neighboring positions | ≥ 5 GΩ |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 490 m/s² |
| Shock duration | 11 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Ambient conditions | |
| Ambient temperature (operation) | -55 °C ... 125 °C |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
Packaging specifications
| Dimensional drawing |  |
| Type of packaging | 44 mm wide tape |
| [W] tape width | 44 mm |
| [W2] coil overall dimension | 50.4 mm |
| [A] coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level | (D) electrostatically conductive |
| Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Datasheet - PDF
▲| Título: | Tamanho: | Tipo: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
|
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