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FFKDSA1/V2-5,08- 8 BD:1-8 1904817 PHOENIX CONTACT Borne de placa de circuito impresso
FFKDSA1/V2-5,08- 8 BD:1-8
1904817
PHOENIX_CONTACT
50
Borne de placa de circuito impresso
Régua de terminais para placa de circuito impresso, corrente nominal: 15 A, tensão de dimensionamento (III/2): 400 V, seção transversal nominal: 1,5 mm², Número de potenciais: 8, Número de linhas: 1, Número de polos por linha: 8, família de artigos: FFKDS(A)/V2, passo: 5,08 mm, tipo de conexão: Conexão push-in por mola, montagem: Solda por onda, direção de conexão do condutor/placa de circuito impresso: 90 °, cor: verde, Disposição dos pinos: Disposição dos pinos lineares duplos, Comprimento dos pinos [P]: 3,4 mm, Tipo de embalagem: em caixa
Printed circuit board terminal, nominal current: 15 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: FFKDS(A)/V2, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear double pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard
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▲Mais informação
▲| Product type | Printed circuit board terminal |
| Product family | FFKDS(A)/V2 |
| Product line | COMBICON Terminals S |
| Type | PC terminal block can be aligned |
| Number of positions | 8 |
| Pitch | 5.08 mm |
| Number of connections | 8 |
| Number of rows | 1 |
| Number of potentials | 8 |
| Pin layout | Linear double pinning |
| Solder pins per potential | 2 |
| Data management status | |
| Article revision | 03 |
| Nominal current IN | 15 A |
| Nominal voltage UN | 400 V |
| Rated voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| Rated voltage (III/2) | 400 V |
| Rated surge voltage (III/2) | 4 kV |
| Rated voltage (II/2) | 630 V |
| Rated surge voltage (II/2) | 4 kV |
| Connection technology | |
| Type | PC terminal block can be aligned |
| Nominal cross section | 1.5 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section rigid | 0.2 mm² ... 1.5 mm² |
| Conductor cross section flexible | 0.2 mm² ... 1.5 mm² |
| Conductor cross section AWG | 24 ... 16 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.25 mm² ... 1.5 mm² |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.25 mm² ... 1.5 mm² |
| Stripping length | 10 mm |
| Mounting type | Wave soldering |
| Pin layout | Linear double pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface terminal point (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface terminal point (middle layer) | Nickel (2 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (5 - 7 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (2 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | green (6021) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Material data – actuating element | |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |  |
| Pitch | 5.08 mm |
| Width [w] | 43.18 mm |
| Height [h] | 19.2 mm |
| Length [l] | 10 mm |
| Installed height | 15.8 mm |
| Solder pin length [P] | 3.4 mm |
| Pin dimensions | 0.5 x 1 mm |
| PCB design | |
| Pin spacing | 7.62 mm |
| Hole diameter | 1.3 mm |
| Test for conductor damage and slackening | |
| Specification | IEC 60999-1:1999-11 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60999-1:1999-11 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 1.5 mm² / solid / > 40 N | |
| 1.5 mm² / flexible / > 40 N | |
| Temperature-rise test | |
| Specification | IEC 60947-7-4:2019-01 |
| Requirement temperature-rise test | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
| Short-time withstand current | |
| Specification | IEC 60947-7-4:2019-01 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 250 V |
| Rated surge voltage (III/3) | 4 kV |
| minimum clearance value - non-homogenous field (III/3) | 3 mm |
| minimum creepage distance (III/3) | 3.2 mm |
| Rated insulation voltage (III/2) | 400 V |
| Rated surge voltage (III/2) | 4 kV |
| minimum clearance value - non-homogenous field (III/2) | 3 mm |
| minimum creepage distance (III/2) | 3 mm |
| Rated insulation voltage (II/2) | 630 V |
| Rated surge voltage (II/2) | 4 kV |
| minimum clearance value - non-homogenous field (II/2) | 3 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60695-2-10:2013-04 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Aging | |
| Specification | IEC 60947-7-4:2019-01 |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Datasheet - PDF
▲| Título: | Tamanho: | Tipo: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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