EMSTBVA 2,5/14-G-5,08/246810UN 1879434 PHOENIX CONTACT De placas de circuito impresso conector Ver maior
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EMSTBVA 2,5/14-G-5,08/246810UN 1879434 PHOENIX CONTACT De placas de circuito impresso conector

EMSTBVA 2,5/14-G-5,08/246810UN

1879434

PHOENIX_CONTACT

50

De placas de circuito impresso conector

PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 14, number of rows: 1, number of positions: 14, number of connections: 14, product range: EMSTBVA 2,5/..-G, pitch: 5.08 mm, mounting: Press-in technology, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

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Dados técnicos

Product properties
Product lineCOMBICON Connectors M
Product typePCB headers
Product familyEMSTBVA 2,5/..-G
Number of positions14
Pitch5.08 mm
Number of connections14
Number of rows1
Mounting flangewithout
Number of potentials14
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties
Nominal current IN12 A
Nominal voltage UN320 V
Degree of pollution3
Contact resistance1.1 mΩ
Rated voltage (III/3)200 V
Rated surge voltage (III/3)4 kV
Rated voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
Rated voltage (II/2)320 V
Rated surge voltage (II/2)4 kV

Mounting
Mounting typePress-in technology
Pin layoutLinear pinning

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (1 - 2 µm Sn)
Metal surface contact area (middle layer)Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (1 - 2 µm Sn)
Metal surface soldering area (middle layer)Nickel (2 - 3 µm Ni)
Material data - housing
Color ()()
Insulating materialPBT
Insulating material groupIIIa
CTI according to IEC 60112225
Flammability rating according to UL 94V0

Notes
Notes on operationIn accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load.

Dimensions
Dimensional drawingvrtjtzpvtt.jpeg
Pitch5.08 mm
Width [w]73.12 mm
Height [h]15.9 mm
Length [l]8.6 mm
Installed height12 mm
Solder pin length [P]3.9 mm
PCB design
Hole diameter1.6 mm

Mechanical tests
Insertion and withdrawal forces
ResultTest passed
No. of cycles25
Insertion strength per pos. approx.5 N
Withdraw strength per pos. approx.4 N

Electrical tests
Insulation resistance
SpecificationIEC 60512-2:1985-00
Insulation resistance, neighboring positions1012Ω
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 225
Rated insulation voltage (III/3)200 V
Rated surge voltage (III/3)4 kV
minimum clearance value - non-homogenous field (III/3)3 mm
minimum creepage distance (III/3)3.2 mm
Rated insulation voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
minimum clearance value - non-homogenous field (III/2)3 mm
minimum creepage distance (III/2)3.2 mm
Rated insulation voltage (II/2)320 V
Rated surge voltage (II/2)4 kV
minimum clearance value - non-homogenous field (II/2)3 mm
minimum creepage distance (II/2)3.2 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:1982 + AMD 2:1985
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Sweep speed5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Durability test
SpecificationDIN VDE 0627:1993-05
Impulse withstand voltage at sea level4.8 kV
Contact resistance R11.1 mΩ
Contact resistance R21.5 mΩ
Insertion/withdrawal cycles25
Climatic test
SpecificationDIN VDE 0627:1993-05
Corrosive stress0.2 dm3SO2on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage2.21 kV
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Título: Tamanho: Tipo:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes

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