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DMC 1,5/14-G1F-3,5-LRP26AUTHRR
1715229
PHOENIX_CONTACT
180
Conector de placa de circuito impresso
Placa de circuito impresso de carcaça base, seção nominal: 1,5 mm², cor: preto, corrente nominal: 8 A, tensão de dimensionamento (III/2): 160 V, contatos de superfície: Ouro, tipo de contato: Masculino, Número de potenciais: 28, Número de linhas: 2, Número de postes por linha: 14, número de conexões: 28, família do artigo: DMC 1.5/.. -G1F-THR, arremesso: 3,5 mm, montagem: THR de soldagem, arranjo do pino: Arranjo linear do pino, comprimento do pino [P]: 2,6 mm, Sistema Steck: MINI COMBICON - DFMC 1.5,Bloqueio: Travamento por tomada, tipo de embalagem: embalagem em caixa
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 28, number of rows: 2, number of positions: 14, number of connections: 28, product range: DMC 1,5/..-G1F-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 1,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting: Lock & release threaded flange, type of packaging: 88 mm wide tape
Conectores > Conector de circuito impresso
Conectores PCB
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Product line | COMBICON Connectors S |
Product type | PCB headers |
Product family | DMC 1,5/..-G1F-THR |
Number of positions | 14 |
Pitch | 3.5 mm |
Number of connections | 28 |
Number of rows | 2 |
Number of potentials | 28 |
Pin layout | Linear pinning |
Solder pins per potential | 1 |
Nominal current IN | 8 A |
Nominal voltage UN | 160 V |
Degree of pollution | 3 |
Contact resistance | 2 mΩ |
Rated voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
Rated voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
Rated voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
Mounting type | THR soldering |
Pin layout | Linear pinning |
Flange | |
Tightening torque | 0.2 Nm |
Processing notes | |
Process | Reflow/wave soldering |
Moisture Sensitive Level | MSL 1 |
Classification temperature Tc | 260 °C |
Solder cycles in the reflow | 3 |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | partially gold-plated |
Metal surface contact area (top layer) | Gold (0.8 - 1.4 µm Au) |
Metal surface contact area (middle layer) | Nickel (2 - 4 µm Ni) |
Metal surface soldering area (top layer) | Gold (0.1 - 0.8 µm Au) |
Metal surface soldering area (middle layer) | Nickel (2 - 4 µm Ni) |
Material data - housing | |
Color (Housing) | black (9005) |
Insulating material | LCP |
Insulating material group | IIIa |
CTI according to IEC 60112 | 175 |
Flammability rating according to UL 94 | V0 |
Dimensional drawing | |
Pitch | 3.5 mm |
Width [w] | 56 mm |
Height [h] | 13.4 mm |
Length [l] | 11.6 mm |
Installed height | 10.8 mm |
Solder pin length [P] | 2.6 mm |
Pin dimensions | 0.8 x 0.8 mm |
PCB design | |
Pin spacing | 2.50 mm |
Hole diameter | 1.4 mm |
Visual inspection | |
Specification | IEC 60512-1-1:2002-02 |
Result | Test passed |
Dimension check | |
Specification | IEC 60512-1-2:2002-02 |
Result | Test passed |
Resistance of inscriptions | |
Specification | IEC 60068-2-70:1995-12 |
Result | Test passed |
Polarization and coding | |
Specification | IEC 60512-13-5:2006-02 |
Result | Test passed |
Contact holder in insert | |
Specification | IEC 60512-15-1:2008-05 |
Contact holder in insert Requirements >20 N | Test passed |
Insertion and withdrawal forces | |
Result | Test passed |
No. of cycles | 100 |
Insertion strength per pos. approx. | 2.6 N |
Withdraw strength per pos. approx. | 1.4 N |
Thermal test Test group C | |
Specification | IEC 60512-5-1:2002-02 |
Tested number of positions | 9 |
Insulation resistance | |
Specification | IEC 60512-3-1:2002-02 |
Insulation resistance, neighboring positions | > 5 MΩ |
Air clearances and creepage distances | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | IIIa |
Comparative tracking index (IEC 60112) | CTI 175 |
Rated insulation voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
minimum creepage distance (III/3) | 2.5 mm |
Rated insulation voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
minimum creepage distance (III/2) | 1.6 mm |
Rated insulation voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
minimum creepage distance (II/2) | 2.5 mm |
Vibration test | |
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 500 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
Sweep speed | 5g (60.1 Hz ... 500 Hz) |
Test duration per axis | 2 h |
Durability test | |
Specification | IEC 60512-9-1:2010-03 |
Impulse withstand voltage at sea level | 2.95 kV |
Contact resistance R1 | 2 mΩ |
Contact resistance R2 | 1.8 mΩ |
Contact resistance R22nd level | 1.9 mΩ |
Insertion/withdrawal cycles | 100 |
Insulation resistance, neighboring positions | > 5 MΩ |
Climatic test | |
Specification | ISO 6988:1985-02 |
Corrosive stress | 1.0 dm3SO2on 300 dm3/40 °C/1 cycle |
Thermal stress | 100 °C/168 h |
Power-frequency withstand voltage | 1.39 kV |
Ambient conditions | |
Ambient temperature (operation) | -40 °C ... 105 °C (dependent on the derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Dimensional drawing | |
Type of packaging | 88 mm wide tape |
[W] tape width | 88 mm |
[W2] coil overall dimension | 94.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Transparent-Bag |
ESD level | (D) electrostatically conductive |
Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Título: | Tamanho: | Tipo: |
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PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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