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SPTD 1,5/ 3-H-3,5 GYLCBKBD:-29 1008002 PHOENIX CONTACT Terminal for printed circuit board, rated voltage: 20..
SPTD 1,5/ 3-H-3,5 GYLCBKBD:-29
1008002
PHOENIX_CONTACT
50
Terminal for printed circuit board, rated voltage: 200 V, pitch: 3.5 mm, number of poles: 3, connection type: spring clamp push-in, mounting: Soldering by wave, color: gray
Terminal block for printed circuit board, nominal current: 10 A, dimensioning voltage (III/2): 200 V, nominal cross-section: 1.5 mm², Number of potentials: 6, Number of rows: 2, Number of poles per row: 3, article family: SPTD 1.5, pitch: 3.5mm, connection type: Push-in spring connection, mounting: Wave soldering, conductor connection direction/printed circuit board: 0°, color: gray, Pin arrangement: Linear pin arrangement, Pin length [P]: 3.5 mm, packaging type: boxed
Printed circuit board terminal, rated current: 10 A, rated voltage (III/2): 200 V, rated cross-section: 1.5 mm2, number of potentials: 6, number of rows: 2, number of poles per row: 3, article family: SPTD 1.5, pitch: 3.5 mm, connection type: Push-in spring connection, mounting: Wave soldering, conductor connection direction/printed circuit board: 0°, color: gray, Pin arrangement: Linear pin arrangement, Pin length [P]: 3.5 mm, number of solder pins per potential: 1, packaging type: boxed
Connectors > Printed circuit board terminal
PCB Connectors (PCC)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲| Product Type | Printed Circuit Board Terminal |
| Product Family | SPTD 1.5 |
| Product Line | COMBICON Terminals S |
| Number of poles | 3 |
| Step | 3.5 mm |
| Number of connections | 6 |
| Number of rows | 2 |
| Number of potentials | 6 |
| Pin Design | Linear Pin Arrangement |
| Number of Solder Pins Per Potential | 1 |
| Data Maintenance Status | |
| Article Review | 00 |
| Nominal Current IN | 10 A |
| Nominal voltage UN | 200 V |
| Sizing voltage (III/3) | 160 V |
| Dimensioning transient voltage (III/3) | 2.5 kV |
| Dimensioning voltage (III/2) | 200 V |
| Dimensioning Transient Voltage (III/2) | 2.5 kV |
| Nominal voltage (II/2) | 400 V |
| Dimensioning transient voltage (II/2) | 2.5 kV |
| Connection technology | |
| Nominal Section | 1.5 mm² |
| Connecting Conductors | |
| Connection type | Push-in spring connection |
| Rigid conductor section | 0.14 mm² ... 1.5 mm² |
| Single conductor/multi-core terminal point | 0.14 mm² ... 1.5 mm² |
| Flexible conductor section | 0.14 mm² ... 1.5 mm² |
| AWG Conductor Section | 26 ... 16 |
| Flexible conductor section with toe cap, without plastic sleeve | 0.2 mm² ... 1.5 mm² |
| Flexible conductor section with toe cap, with plastic sleeve | 0.2 mm² ... 0.75 mm² |
| Peel Length | 8 mm |
| Type of mounting | Wave soldering |
| Pin Design | Linear Pin Arrangement |
| Material data - contact | |
| Observation | WEEE/RoHS compliant, filament-free according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu Alloy |
| Surface Characteristics | Galvanically tinned |
| Metal surface of the terminal point (top layer) | Tin (5 - 7 μm Sn) |
| Metal surface of the terminal point (interlayer) | Nickel (1.5 - 4 μm Ni) |
| Metal surface weld area (top layer) | Tin (5 - 7 μm Sn) |
| Metal Surface Welding Area (Middle Layer) | Nickel (1.5 - 4 μm Ni) |
| Material data - housing | |
| Color (Housing) | Grey (7042) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability class according to UL 94 | V0 |
| Flammability number of GWFI incandescent filaments according to EN 60695-2-12 | 850 |
| Ignition temperature of incandescent filaments GWIT according to EN 60695-2-13 | 775 |
| Ball hardness test temperature according to EN 60695-10-2 | 125 °C |
| Material data: drive element | |
| Color (Drive Element) | Orange (2003) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability class according to UL 94 | V0 |
| Dimension Scheme |  |
| Step | 3.5 mm |
| Width [w] | 15.5 mm |
| Height [h] | 24.2 mm |
| Length [l] | 18 mm |
| Overall Height | 24.2 mm |
| Weld Pin Length [P] | 3.5 mm |
| Temple Dimensions | 0.6 x 1 mm |
| Printed circuit board design | |
| Spacing between rods | 9.35 mm |
| Hole diameter | 1.3 mm |
| Checking for damage to conductors and loosening | |
| Test Specification | DIN EN 60999-1 (VDE 0609-1):2000-12 |
| Result | Approved Test |
| Tensile Test | |
| Test Specification | DIN EN 60999-1 (VDE 0609-1):2000-12 |
| Conductor Section/Conductor Type/Tensile Force Nominal Value/Actual Value | 0.14 mm² / rigid / > 10 N |
| 0.14 mm² / flexible / > 10 N | |
| 1.5 mm² / rigid / > 40 N | |
| 1.5 mm² / flexible / > 40 N | |
| Heating Verification | |
| Test Specification | DIN EN 60947-7-4 (VDE 0611-7-4):2014-08 |
| Heating test requirement | The sum of the ambient temperature and the heating of the PCB connection terminal cannot exceed the upper limit temperature. |
| Short-term permissible current | |
| Test Specification | DIN EN 60947-7-4 (VDE 0611-7-4):2014-08 |
| Insulation resistance | |
| Test Specification | DIN EN 60512-3-1:2003-01 |
| Insulation Resistance Adjacent Poles | > 5 MΩ |
| Creepage Lines & Air Isolation Distances | |
| Test Specification | DIN EN 60947-1 (VDE 0660-100):2011-10 |
| Insulating material group | I |
| Resistance to leakage currents (DIN EN 60112 (VDE 0303-11)) | CTI 600 |
| Sizing Insulation Voltage (III/3) | 160 V |
| Nominal transient voltage (III/3) | 2.5 kV |
| minimum value of air insulation distance - non-homogeneous field (III/3) | 1.5 mm |
| Minimum creepage line value (III/3) | 2 mm |
| Sizing Insulation Voltage (III/2) | 200 V |
| Nominal transient voltage (III/2) | 2.5 kV |
| Minimum Value of Air Insulation Distance - Non-Homogeneous Field (III/2) | 1.5 mm |
| Minimum creepage line value (III/2) | 1.5 mm |
| Sizing Insulation Voltage (II/2) | 400 V |
| Nominal transient voltage (II/2) | 2.5 kV |
| Minimum Value of Air Insulation Distance - Non-Homogeneous Field (II/2) | 1.5 mm |
| Minimum creepage line value (II/2) | 2 mm |
| Vibration test | |
| Test Specification | DIN EN 60068-2-6 (VDE 0468-2-6):2008-10 |
| frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test Directions | X, Y, and Z axes |
| Essay filam. incandescent | |
| Test Specification | DIN EN 60695-2-10 (VDE 0471-2-10):2001-11 |
| Temperature | 850 °C |
| Performance Time | 5 s |
| Aging | |
| Test Specification | DIN EN 60947-7-4 (VDE 0611-7-4):2014-08 |
| Environmental conditions | |
| Ambient Temperature (Service) | -40 °C ... 100 °C (Based on current/derating load capacity curve) |
| Ambient Temperature (Storage/Transport) | -40 °C ... 70 °C |
| Relative humidity of the air (storage/transport) | 30 % ... 70 % |
| Ambient Temperature (Mounting) | -5 °C ... 100 °C |
| Type of packaging | Boxed Packaging |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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