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SPE-T1-M12MSM-180 1363336 PHOENIX CONTACT SPE PCB Connectors, Construction: SPE, Protection Index: IP65/IP67..
SPE-T1-M12MSM-180
1363336
PHOENIX_CONTACT
80
SPE PCB Connectors, Construction: SPE, Protection Index: IP65/IP67, Number of Poles: 2, Material: Metal, Connection Type: THR Soldering Connection, Cable Outlet: Straight, Color: Black, Single Pair Ethernet
SPE PCB connector, design: SPE, degree of protection: IP65/IP67, number of positions: 2, material: LCP, connection method: THR solder connection, cable outlet: straight, color: black, Single Pair Ethernet
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* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲| Type | SPE |
| Product type | Data connector (device side) |
| Sensor type | Single Pair Ethernet |
| Number of positions | 2 |
| Type of packaging | Tape and Reel |
| [W] tape width | 44.00 mm |
| [A] coil diameter | 330.00 mm |
| [W2] coil overall dimension | 50.40 mm |
| Number of slots | 1 |
| Cable outlet | straight |
| Thread type | M12 |
| Insulation characteristics | |
| Overvoltage category | II |
| Degree of pollution | 2 |
| Maximum load current | 4 A |
| Rated surge voltage | 500 V |
| Rated current | 4 A |
| Insulation resistance | min. 1 TΩ |
| Contact resistance | 20 mΩ |
| Transmission medium | Copper |
| Transmission characteristics (category) | CAT B |
| Transmission speed | 1 Gbps |
| Power transmission | PoDL |
| Transmission frequency | 600.00 MHz |
| Connection technology | |
| Connection method | THR solder connection |
| Width | 12.4 mm |
| Height | 23.8 mm |
| Length | 13.7 mm |
| Installed height | 21.60 mm |
| Orientation to | 180.00 ° |
| Color | black |
| Color of the housing part | black |
| Material | Au |
| Ni | |
| Au | |
| Ni | |
| Flammability rating according to UL 94 | V0 |
| Housing surface material | LCP |
| Contact material | Cu alloy |
| Contact surface material | Au/Ni |
| Housing material | LCP |
| Test voltage Core/Core | 1000 V DC |
| Test voltage Core/Shield | 2250 V DC |
| Test voltage, cable | 300 V |
| Mechanical data | |
| Insertion/withdrawal cycles | > 100 |
| Insertion force per signal contact | < 30.00 N (in accordance with IEC 63171) |
| Extraction force per signal contact | < 30 N (in accordance with IEC 63171) |
| Smallest bending radius | 21,2 mm |
| Test specification | |
| Type of test | Vibration test |
| Specification | IEC 60068-2-6 |
| Frequency | 10-500 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm |
| Acceleration | 50 m/s² |
| Test duration | 2 h |
| Test specification | |
| Specification | IEC 63171 |
| Corrosive stress | IEC 60512-11-7 |
| Contact resistance R1 | 20 mΩ |
| Test specification | |
| Type of test | Mechanical service life with corrosion test |
| Specification | DIN EN 60512-9-1 |
| Test specification | |
| Type of test | Shock testing |
| Specification | IEC 60068-2-27 |
| Acceleration | 150 m/s² |
| Number of shocks per direction | 2000 |
| Ambient conditions | |
| Degree of protection | IP65/IP67 |
| Ambient temperature (operation) | -40 °C ... 85 °C (Harsh environment) |
| Ambient temperature (storage/transport) | -40 °C ... 85 °C (DIN EN 60512-6-3) |
| Resistance to UV radiation | yes |
| Resistance to UV radiation | yes |
| Mounting type | PCB mounting |
| Connection method | THR solder connection |
| Processing notes | |
| Process | Reflow |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
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