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SAMPLE SPT-SMD 1,5/10-H-3,5 1838694 PHOENIX CONTACT Sample set
SAMPLE SPT-SMD 1,5/10-H-3,5
1838694
PHOENIX_CONTACT
5
Sample set
Terminal block for printed circuit board, nominal current: 13.5 A, dimensioning voltage (III/2): 160 V, nominal section: 1.5 mm², Number of potentials: 10, Number of rows: 1, Number of poles per row: 10, article family: SPT 1.5/.. -H-SMD, pitch: 3.5 mm, connection type: Push-in spring connection, mounting: SMD soldering, driver/printed circuit board connection direction: 0 °, color: black, Pin arrangement: Linear pad geometry, packaging type: boxed packaging. SAMPLE set with 5 items on strap. For use in a welding process, use the item without the SAMPLE identification
Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: SPT 1,5/..-H-SMD, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pad geometry, number of solder pins per potential: 1, type of packaging: packed in cardboard. SAMPLE set with 5 items in belt section. When used as part of soldering process, please use items without SAMPLE marking
PCB Connectors (PCC)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲More info
▲| Product type | Printed circuit board terminal |
| Product family | SPT 1,5/..-H-SMD |
| Product line | COMBICON Terminals S |
| Number of positions | 10 |
| Pitch | 3.5 mm |
| Number of connections | 10 |
| Number of rows | 1 |
| Number of potentials | 10 |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 02 |
| Nominal current IN | 17.5 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Connection technology | |
| Nominal cross section | 1.5 mm² |
| Conductor connection | |
| Connection method | Push-in spring connection |
| Conductor cross section rigid | 0.2 mm² ... 1.5 mm² |
| Conductor cross section flexible | 0.2 mm² ... 1.5 mm² |
| Conductor cross section AWG | 24 ... 16 |
| Conductor cross section flexible, with ferrule without plastic sleeve | 0.2 mm² ... 1.5 mm² |
| Conductor cross section, flexible, with ferrule, with plastic sleeve | 0.2 mm² ... 0.75 mm² |
| Stripping length | 8 mm |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | hot-dip tin-plated |
| Metal surface terminal point (top layer) | Tin (4 - 8 µm Sn) |
| Metal surface soldering area (top layer) | Tin (4 - 8 µm Sn) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | LCP |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 175 |
| Flammability rating according to UL 94 | V0 |
| Material data – actuating element | |
| Color (Actuating element) | white (9010) |
| Insulating material | PA GF |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Notes on operation | The solder anchors on the outer poles reduce the mechanical strain on the SMD soldering spots. |
| Assembly note | This item is not suitable for PCB cleaning with liquids. |
| Dimensional drawing |  |
| Pitch | 3.5 mm |
| Width [w] | 35.5 mm |
| Height [h] | 7.7 mm |
| Length [l] | 13.6 mm |
| Installed height | 7.7 mm |
| Pin dimensions | 0.7 x 0.3 mm |
| PCB design | |
| Pad geometry | 1.6 x 4 mm |
| Pin spacing | 7 mm |
| Hole diameter | 1.1 mm |
| Connection test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Test for conductor damage and slackening | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Pull-out test | |
| Specification | IEC 60998-2-2:2002-12 |
| Conductor cross section/conductor type/tractive force setpoint/actual value | 0.2 mm² / solid / > 10 N |
| 0.2 mm² / flexible / > 10 N | |
| 1.5 mm² / solid / > 40 N | |
| 1.5 mm² / flexible / > 40 N | |
| Flexion test | |
| Specification | IEC 60998-2-2:2002-12 |
| Result | Test passed |
| Temperature-rise test | |
| Specification | IEC 60947-7-4:2019-01 |
| Requirement temperature-rise test | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
| Insulation resistance | |
| Specification | IEC 60998-1:2002-12 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 175 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Glow-wire test | |
| Specification | IEC 60998-1:2002-12 |
| Temperature | 850 °C |
| Time of exposure | 5 s |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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