SAMPLE DMCV 0,5/ 6-G1-2,54 THR 1859686 PHOENIX CONTACT PCB headers, nominal current: 6 A, rated voltage (III.. View larger
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SAMPLE DMCV 0,5/ 6-G1-2,54 THR 1859686 PHOENIX CONTACT PCB headers, nominal current: 6 A, rated voltage (III..

SAMPLE DMCV 0,5/ 6-G1-2,54 THR

1859686

PHOENIX_CONTACT

5

PCB headers, nominal current: 6 A, rated voltage (III/2): 160 V, number of positions: 6, pitch: 2.54 mm, color: black, contact surface: Gold, mounting: THR soldering

Printed circuit board base housing, nominal section: 0.5 mm², color: black, nominal current: 6 A, nominal voltage (III/2): 160 V, contact surface: Gold, contact type: Male, number of potentials: 12, number of rows: 2, number of poles: 6, number of connections: 12, family of articles: DMCV 0.5/.. -G1-THR, pitch: 2.54 mm, mounting: Solder THR, pin length [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0.5, Plug-in face orientation: Standard, locking: without, fixing type: without, packaging type: boxed

PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 12, number of rows: 2, number of positions: 6, number of connections: 12, product range: DMCV 0,5/..-G1-THR, pitch: 2.54 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

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PCB Connectors (PCC)

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Technical data

Product properties
Product typePCB headers
Product familyDMCV 0,5/..-G1-THR
Product lineCOMBICON Connectors XS
TypeComponent suitable for through hole reflow
Number of positions6
Pitch2.54 mm
Number of connections12
Number of rows2
Number of potentials12
Mounting flangewithout
Pin layoutLinear pinning
Solder pins per potential1
Data management status
Article revision01

Electrical properties
Nominal current IN6 A
Nominal voltage UN160 V
Contact resistance2.5 mΩ
Rated voltage (III/3)32 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)160 V
Rated surge voltage (II/2)2.5 kV

Mounting
Mounting typeTHR soldering / wave soldering
Pin layoutLinear pinning
Processing notes
ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc260 °C
Solder cycles in the reflow3

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsCompletely gold-plated
Metal surface contact area (top layer)Gold (0.25 Au)
Metal surface contact area (middle layer)Nickel (2 - 4 µm Ni)
Metal surface soldering area (top layer)Gold (0.25 Au)
Metal surface soldering area (middle layer)Nickel (2 - 4 µm Ni)
Material data - housing
Color (Housing)black (9005)
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0

Dimensions
Dimensional drawingdvbtjqggdc.jpg
Pitch2.54 mm
Width [w]15.74 mm
Height [h]7.1 mm
Length [l]7.39 mm
Installed height5.39 mm
Solder pin length [P]2 mm
Pin dimensions0.64 x 0.64 mm
PCB design
Pin spacing2.54 mm
Hole diameter1.2 mm

Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles100
Insertion strength per pos. approx.2 N
Withdraw strength per pos. approx.1 N

Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions16
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)32 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)1.5 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)160 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)1.6 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 500 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 500 Hz)
Test duration per axis2 h
Test directionsX-, Y- and Z-axis
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R12.5 mΩ
Contact resistance R22.6 mΩ
Contact resistance R22nd level2.5 mΩ
Insertion/withdrawal cycles100
Insulation resistance, neighboring positions> 5 MΩ
Climatic test
SpecificationDIN 50018:2013-05
Corrosive stress1.0 dm3SO2on 300 dm3/40 °C/3 cycles
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Title: Size: Type:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes

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