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PTSM 0,5/ 3-HV-2,5-SMD BK R44
1553823
PHOENIX_CONTACT
400
PCB base housing, nominal cross-section: 0.5 mm², colour: black, nominal current: 6 A, nominal voltage (III/2): 160 V, surface contacts: Tin, contact connection type: Male, number of rows: 1, number of poles: 3, article family: PTSM 0.5/.. -HV-SMD WH, Pitch: 2.5mm, Mounting: SMD Soldering, Pin Arrangement: Linear Pin Arrangement, Pin Length [P]: 2mm, Number of Solder Pins by Potential: 1, Plug-in System: COMBICON PTSM, Plug-in Face Orientation: Standard, Lock: Sin, Attachment Type: Sin, Packing Type: 44mm Wide Strap
PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of rows: 1, number of positions: 3, product range: PTSM 0,5/..-HV-SMD WH, pitch: 2.5 mm, mounting: SMD soldering, pin layout: Linear pad geometry, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape
PCB Connectors (PCC)
* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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Product line | COMBICON Connectors XS |
Product type | PCB headers |
Product family | PTSM 0,5/..-HV-SMD WH |
Number of positions | 3 |
Pitch | 2.5 mm |
Number of rows | 1 |
Pin layout | Linear pad geometry |
Solder pins per potential | 1 |
Nominal current IN | 6 A |
Nominal voltage UN | 160 V |
Degree of pollution | 3 |
Contact resistance | 2.2 mΩ |
Rated voltage (III/3) | 125 V |
Rated surge voltage (III/3) | 2.5 kV |
Rated voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
Rated voltage (II/2) | 320 V |
Rated surge voltage (II/2) | 2.5 kV |
Mounting type | SMD soldering |
Pin layout | Linear pad geometry |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | Tin-plated |
Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Material data - housing | |
Color (Housing) | black (9005) |
Insulating material | PA |
Insulating material group | I |
CTI according to IEC 60112 | 600 |
Flammability rating according to UL 94 | V0 |
Dimensional drawing | |
Pitch | 2.5 mm |
Width [w] | 13.1 mm |
Height [h] | 9.5 mm |
Length [l] | 5 mm |
Installed height | 7.5 mm |
Solder pin length [P] | 2 mm |
PCB design | |
Pad geometry | 1.2 x 4.4 mm |
Hole diameter | 1 mm |
Visual inspection | |
Specification | IEC 60512-1-1:2002-02 |
Result | Test passed |
Dimension check | |
Specification | IEC 60512-1-2:2002-02 |
Result | Test passed |
Resistance of inscriptions | |
Specification | IEC 60068-2-70:1995-12 |
Result | Test passed |
Polarization and coding | |
Specification | IEC 60512-13-5:2006-02 |
Result | Test passed |
Contact holder in insert | |
Specification | IEC 60512-15-1:2008-05 |
Contact holder in insert Requirements >20 N | Test passed |
Insertion and withdrawal forces | |
Result | Test passed |
No. of cycles | 10 |
Insertion strength per pos. approx. | 5 N |
Withdraw strength per pos. approx. | 3 N |
Thermal test | Test group C | |
Specification | IEC 60512-5-1:2002-02 |
Tested number of positions | 8 |
Insulation resistance | |
Specification | IEC 60512-3-1:2002-02 |
Insulation resistance, neighboring positions | > 5 MΩ |
Air clearances and creepage distances | | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | I |
Comparative tracking index (IEC 60112) | CTI 600 |
Rated insulation voltage (III/3) | 125 V |
Rated surge voltage (III/3) | 2.5 kV |
minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
minimum creepage distance (III/3) | 1.9 mm |
Rated insulation voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
minimum creepage distance (III/2) | 1.5 mm |
Rated insulation voltage (II/2) | 320 V |
Rated surge voltage (II/2) | 2.5 kV |
minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
minimum creepage distance (II/2) | 1.6 mm |
Vibration test | |
Specification | IEC 60068-2-6:2007-12 |
Frequency | 10 - 150 - 10 Hz |
Sweep speed | 1 octave/min |
Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
Sweep speed | 5g (60.1 Hz ... 150 Hz) |
Test duration per axis | 2.5 h |
Durability test | |
Specification | IEC 60512-9-1:2010-03 |
Impulse withstand voltage at sea level | 2.95 kV |
Contact resistance R1 | 2.2 mΩ |
Contact resistance R2 | 2.4 mΩ |
Insertion/withdrawal cycles | 10 |
Insulation resistance, neighboring positions | > 5 MΩ |
Climatic test | |
Specification | ISO 6988:1985-02 |
Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
Thermal stress | 100 °C/168 h |
Power-frequency withstand voltage | 1.39 kV |
Ambient conditions | |
Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Dimensional drawing | |
Type of packaging | 44 mm wide tape |
[W] tape width | 32 mm |
[W2] coil overall dimension | 38.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Transparent-Bag |
ESD level | (D) electrostatically conductive |
Specification | DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 |
Title: | Size: | Type: |
---|---|---|
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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