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MCV 1,5/ 9-GFL-3,5 GN THTV0007
1769362
PHOENIX_CONTACT
300
Printed-circuit board connector
PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 9, number of rows: 1, number of positions: 9, number of connections: 9, product range: MCV 1,5/..-GFL-THT, pitch: 3.5 mm, mounting: THR soldering, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: 56 mm wide tape
PCB Connectors (PCC)
* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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Product line | COMBICON Connectors S |
Product type | PCB headers |
Product family | MCV 1,5/..-GFL-THT |
Number of positions | 9 |
Pitch | 3.5 mm |
Number of connections | 9 |
Number of rows | 1 |
Number of potentials | 9 |
Solder pins per potential | 1 |
Nominal current IN | 8 A |
Nominal voltage UN | 160 V |
Degree of pollution | 3 |
Rated voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
Rated voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
Rated voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
Mounting type | THR soldering |
Flange | |
Tightening torque | 0.3 Nm |
Material data - contact | |
Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
Contact material | Cu alloy |
Surface characteristics | Tin-plated |
Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
Material data - housing | |
Color () | () |
Insulating material | PA |
Insulating material group | IIIa |
CTI according to IEC 60112 | 250 |
Flammability rating according to UL 94 | V0 |
Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
Dimensional drawing | |
Pitch | 3.5 mm |
Pin dimensions | 0.8 x 0.8 mm |
Air clearances and creepage distances | |
Specification | IEC 60664-1:2007-04 |
Insulating material group | IIIa |
Comparative tracking index (IEC 60112) | CTI 250 |
Rated insulation voltage (III/3) | 160 V |
Rated surge voltage (III/3) | 2.5 kV |
minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
minimum creepage distance (III/3) | 2.5 mm |
Rated insulation voltage (III/2) | 160 V |
Rated surge voltage (III/2) | 2.5 kV |
minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
minimum creepage distance (III/2) | 1.6 mm |
Rated insulation voltage (II/2) | 250 V |
Rated surge voltage (II/2) | 2.5 kV |
minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
minimum creepage distance (II/2) | 2.5 mm |
Ambient conditions | |
Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
Ambient temperature (storage/transport) | -40 °C ... 70 °C |
Relative humidity (storage/transport) | 30 % ... 70 % |
Ambient temperature (assembly) | -5 °C ... 100 °C |
Dimensional drawing | |
Type of packaging | 56 mm wide tape |
[W] tape width | 56 mm |
[W2] coil overall dimension | 62.4 mm |
[A] coil diameter | 330 mm |
Outer packaging type | Dry bag |
Title: | Size: | Type: |
---|---|---|
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 15 Mbytes |
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