MCV 1,5/ 2-GSF-3,5 GN P26 THT 1775369 PHOENIX CONTACT Housing base printed circuit board, nominal current: 8.. View larger
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MCV 1,5/ 2-GSF-3,5 GN P26 THT 1775369 PHOENIX CONTACT Housing base printed circuit board, nominal current: 8..

MCV 1,5/ 2-GSF-3,5 GN P26 THT

1775369

PHOENIX_CONTACT

50

Housing base printed circuit board, nominal current: 8 A, voltage and sizing (III/2): 160 V, number of poles: 2, pitch: 3.5 mm, color: green, surface of contact: Tin, assembly: Soldering THR, you will Find more information for the user, and design recommendations on technology, Through Hole Reflow in 'Downloads'

Base housing printed circuit board, nominal section: 1.5 mm², colour: green, rated current: 8 A, sizing voltage (III/2): 160 V, surface contacts: Tin, contact type: Male, Number of potentials: 2, Number of rows: 1, Number of poles per row: 2, number of connections: 2, article family: MCV 1.5/.. -GSF, pitch: 3.5 mm, mounting: THR welding, pin arrangement: Linear pin arrangement, pin length [P]: 2.6 mm, Stecksystem: MINI COMBICON, Locking: Screw lock, packaging type: boxed packaging, More user information and design recommendations on Through Hole Reflow technology can be found at: Downloads

PCB base housing, nominal cross-section: 1.5 mm2, color: green, nominal current: 8 A, nominal voltage (III/2): 160 V, surface contacts: Tin, contact connection type: Male, number of potentials: 2, number of rows: 1, number of poles: 2, number of connections: 2, family of articles: MCV 1.5/..

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PCB Connectors (PCC)

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Technical data

Item Properties
ConstructionSuitable component for Through Hole Reflow
Product LineCOMBICON Connectors S
Product TypePrinted circuit board base housing
Product FamilyMCV 1.5/.. -GSF
Number of poles2
Step3.5 mm
Number of connections2
Number of rows1
Clamping flangeOverhead clamping (thread)
Number of potentials2
Pin DesignLinear Pin Arrangement
Number of Solder Pins Per Potential1

Electrical Properties
Nominal Current IN8 A
Nominal voltage UN160 V
Degree of pollution3
Contact resistance1.2 mΩ
Sizing voltage (III/3)160 V
Dimensioning transient voltage (III/3)2.5 kV
Dimensioning voltage (III/2)160 V
Dimensioning Transient Voltage (III/2)2.5 kV
Nominal voltage (II/2)320 V
Dimensioning transient voltage (II/2)2.5 kV

assembly
Type of mountingSolder THR
Pin DesignLinear Pin Arrangement
bridle
Tightening torque0.3 Nm

Material Data
Material data - contact
ObservationWEEE/RoHS compliant, filament-free according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu Alloy
Surface CharacteristicsGalvanically tinned
Metal surface contact area (top layer)Tin (3 - 5 μm Sn)
Metal Surface Contact Area (Middle Layer)Nickel (1.3 - 3 μm Ni)
Metal surface weld area (top layer)Tin (3 - 5 μm Sn)
Metal Surface Welding Area (Middle Layer)Nickel (1.3 - 3 μm Ni)
Material data - housing
Color (Housing)Green (6021)
Insulating materialPA
Insulating material groupIIIa
CTI according to IEC 60112250
Flammability class according to UL 94V0
Flammability number of GWFI incandescent filaments according to EN 60695-2-12850
Ignition temperature of incandescent filaments GWIT according to EN 60695-2-13775
Ball hardness test temperature according to EN 60695-10-2125 °C

Dimensions
Dimension Schemexafhfprsoi.jpg
Step3.5 mm
Length [l]7.25 mm
Weld Pin Length [P]2.6 mm
Temple Dimensions0.8 x 0.8 mm
Printed circuit board design
Hole diameter1.4 mm

Mechanical testing
Eye Exam
Test SpecificationDIN EN 60512-1-1:2003-01
ResultApproved Test
Dimensional Examination
Test SpecificationDIN EN 60512-1-2:2003-01
ResultApproved Test
Resistance of the signs
Test SpecificationDIN EN 60068-2-70:1996-07
ResultApproved Test
Polarization & Coding
Test SpecificationDIN EN 60512-13-5:2006-11
ResultApproved Test
Used contact holder
Test SpecificationDIN EN 60512-15-1:2009-03
Contact Holder Used
Requirement >20 N
Approved Test
Forces when plugging in and unplugging
ResultApproved Test
Number of cycles25
Plug-in force approx.8 N
Power when unplugging by pole approx.5 N

Electrical Testing
Thermal Test Test Group C
Test SpecificationDIN EN 60512-5-1:2003-01
Number of poles tested12
Insulation resistance
Test SpecificationDIN EN 60512-3-1:2003-01
Insulation Resistance Adjacent Poles> 5 MΩ
Creepage Lines & Air Isolation Distances
Test SpecificationDIN EN 60664-1 (VDE 0110-1):2008-01
Insulating material groupIIIa
Resistance to leakage currents (DIN EN 60112 (VDE 0303-11))CTI 225
Sizing Insulation Voltage (III/3)160 V
Nominal transient voltage (III/3)2.5 kV
minimum value of air insulation distance - non-homogeneous field (III/3)1.5 mm
Minimum creepage line value (III/3)2.5 mm
Sizing Insulation Voltage (III/2)160 V
Nominal transient voltage (III/2)2.5 kV
Minimum Value of Air Insulation Distance - Non-Homogeneous Field (III/2)1.5 mm
Minimum creepage line value (III/2)1.6 mm
Sizing Insulation Voltage (II/2)320 V
Nominal transient voltage (II/2)2.5 kV
Minimum Value of Air Insulation Distance - Non-Homogeneous Field (II/2)1.5 mm
Minimum creepage line value (II/2)3.2 mm

Environmental and life-life conditions
Vibration test
Test SpecificationDIN EN 60068-2-6 (VDE 0468-2-6):2008-10
frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Sweep speed5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Durability Test
Test SpecificationDIN EN 60512-9-1 (VDE 0687-512-9-1):2010-12
Bearable shock voltage at sea level2.95 kV
Contact Resistance R11.2 mΩ
Contact Resistance R21.2 mΩ
Plug Cycles25
Insulation Resistance Adjacent Poles> 5 MΩ
Climate Essay
Test SpecificationDIN EN ISO 6988:1997-03
Corrosion fatigue0.2 dm3UNDER2in 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168 h
Bearable AC voltage1.39 kV
Crash
Test SpecificationDIN EN 60068-2-27 (VDE 0468-2-27):2010-02
Shock TypeSemi-sinusoidal
Acceleration30g
Duration of the crash18 ms
Test DirectionsX, Y, and Z axes (pos. and neg.)
Environmental conditions
Ambient Temperature (Service)-40 °C ... 100 °C (depending on the rating curve)
Ambient Temperature (Storage/Transport)-40 °C ... 70 °C
Relative humidity of the air (storage/transport)30 % ... 70 %
Ambient Temperature (Mounting)-5 °C ... 100 °C

Packaging Information
Type of packagingBoxed Packaging
Outer packing typeDry bag

Datasheet - PDF

Title: Size: Type:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes

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