No products
Product successfully added to your shopping cart
View larger
MCV 1,5/13-GEF-3,5GNP26THTG72S 1775479 PHOENIX CONTACT Housing base printed circuit board, nominal current: ..
MCV 1,5/13-GEF-3,5GNP26THTG72S
1775479
PHOENIX_CONTACT
300
Housing base printed circuit board, nominal current: 8 A, number of poles: 13, pitch: 3.5 mm, color: green, surface contacts: Tin
Base housing printed circuit board, nominal section: 1.5 mm², color: green, rated current: 8 A, sizing voltage (III/2): 160 V, surface contacts: Tin, contact type: Male, Number of potentials: 13, Number of rows: 1,Number of poles per row: 13, number of connections: 13, article family: MCV 1.5/.. -GSF, pitch: 3.5 mm, mounting: THR welding, pin arrangement: Linear pin arrangement, pin length [P]: 2.6 mm, Stecksystem: MINI COMBICON, Locking: Screw lock, packing type: box packed
PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 13, number of rows: 1, number of positions: 13, number of connections: 13, product range: MCV 1,5/..-GSF, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: packed in cardboard
PCB Connectors (PCC)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
Best sellers
▲More info
▲| Product type | PCB headers |
| Product family | MCV 1,5/..-GSF |
| Product line | COMBICON Connectors S |
| Number of positions | 13 |
| Pitch | 3.5 mm |
| Number of connections | 13 |
| Number of rows | 1 |
| Number of potentials | 13 |
| Mounting flange | Threaded flange |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 02 |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Contact resistance | 1.2 mΩ |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Flange | |
| Tightening torque | 0.3 Nm |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color () | () |
| Insulating material | PA |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 250 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |  |
| Pitch | 3.5 mm |
| Solder pin length [P] | 2.6 mm |
| Pin dimensions | 0.8 x 0.8 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N | Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 25 |
| Insertion strength per pos. approx. | 8 N |
| Withdraw strength per pos. approx. | 5 N |
| Thermal test Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 12 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 225 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 3.2 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Contact resistance R1 | 1.2 mΩ |
| Contact resistance R2 | 1.2 mΩ |
| Insertion/withdrawal cycles | 25 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 1.39 kV |
| Shocks | |
| Specification | IEC 60068-2-27:2008-02 |
| Pulse shape | Semi-sinusoidal |
| Acceleration | 30g |
| Shock duration | 18 ms |
| Test directions | X-, Y- and Z-axis (pos. and neg.) |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
Reviews (0) ▲
No customer reviews for the moment.
| Rating: |
|
| Name: | |
| Email: | |
| Subject: | |
| Text: | |
| Do you recommend this product to buy? | |
|
|
|
| Add review | |
All ratings we receive from the items we offer are real and verified. A small gesture, but a lot of value. That's why we thank you for that minute you invest in leaving us your opinion and qualification about the products, because it helps us to continue improving and to offer you a service of even higher quality.