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MC 1,5/15-G-3,5-HT BK 1715714 PHOENIX CONTACT Printed-circuit board connector
MC 1,5/15-G-3,5-HT BK
1715714
PHOENIX_CONTACT
50
Printed-circuit board connector
Printed circuit board base housing, nominal section: 1.5 mm², color: black, nominal current: 8 A, nominal voltage (III/2): 160 V, contact surface: Tin, contact type: Male, number of potentials: 15, number of rows: 1, number of poles: 15, number of connections: 15, article family: MC 1.5/.. -G-HT, pitch: 3.5 mm, mounting: Solder THR, pin arrangement: Linear pin arrangement, pin length [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1.5, Plug-in face orientation: Standard, lock: without, fixing type: without, packaging type: boxed
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 15, number of rows: 1, number of positions: 15, number of connections: 15, product range: MC 1,5/..-G-HT, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
Connectors > Printed circuit board connector
PCB Connectors (PCC)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲| Product type | PCB headers |
| Product family | MC 1,5/..-G-HT |
| Product line | COMBICON Connectors S |
| Number of positions | 15 |
| Pitch | 3.5 mm |
| Number of connections | 15 |
| Number of rows | 1 |
| Number of potentials | 15 |
| Pin layout | Linear pinning |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 03 |
| Nominal current IN | 8 A |
| Nominal voltage UN | 160 V |
| Rated voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | THR soldering / wave soldering |
| Pin layout | Linear pinning |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | black (9005) |
| Insulating material | PA |
| Insulating material group | IIIa |
| CTI according to IEC 60112 | 250 |
| Flammability rating according to UL 94 | V0 |
| Glow wire flammability index GWFI according to EN 60695-2-12 | 850 |
| Glow wire ignition temperature GWIT according to EN 60695-2-13 | 775 |
| Temperature for the ball pressure test according to EN 60695-10-2 | 125 °C |
| Dimensional drawing |  |
| Pitch | 3.5 mm |
| Width [w] | 53.9 mm |
| Height [h] | 10.65 mm |
| Length [l] | 9.2 mm |
| Installed height | 7.25 mm |
| Solder pin length [P] | 3.4 mm |
| PCB design | |
| Hole diameter | 1.2 mm |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | IIIa |
| Comparative tracking index (IEC 60112) | CTI 250 |
| Rated insulation voltage (III/3) | 160 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 2.5 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.6 mm |
| Rated insulation voltage (II/2) | 250 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 2.5 mm |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
| Outer packaging type | Dry bag |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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