MC 0,5/ 3-G-2,5 THT PIN14-R44 1742444 PHOENIX CONTACT Housing base printed circuit board, nominal current: 4.. View larger
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MC 0,5/ 3-G-2,5 THT PIN14-R44 1742444 PHOENIX CONTACT Housing base printed circuit board, nominal current: 4..

MC 0,5/ 3-G-2,5 THT PIN14-R44

1742444

PHOENIX_CONTACT

140

Housing base printed circuit board, nominal current: 4 A, number of poles: 3, pitch: 2.5 mm, color: black, surface contacts: Tin

PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of rows: 1, number of positions: 3, product range: MC 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

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PCB Connectors (PCC)

Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT

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Technical data

Product properties
Product lineCOMBICON Connectors XS
Product typePCB headers
Product familyMC 0,5/..-G-THT
Number of positions3
Pitch2.5 mm
Number of rows1
Mounting flangewithout
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties
Nominal current IN4 A
Nominal voltage UN160 V
Degree of pollution3
Contact resistance2 mΩ
Rated voltage (III/3)32 V
Rated surge voltage (III/3)1.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)160 V
Rated surge voltage (II/2)1.5 kV

Mounting
Mounting typeTHR soldering
Pin layoutLinear pinning
Processing notes
ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 3
Classification temperature Tc245 °C
Solder cycles in the reflow3

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (1 - 3 µm Ni)
Material data - housing
Color ()()
Insulating materialPA
Insulating material groupIIIa
CTI according to IEC 60112250
Flammability rating according to UL 94V0
Glow wire flammability index GWFI according to EN 60695-2-12850
Glow wire ignition temperature GWIT according to EN 60695-2-13775
Temperature for the ball pressure test according to EN 60695-10-2125 °C

Dimensions
Dimensional drawingfapzxoqmlh.jpeg
Pitch2.5 mm
Installed height9 mm
Solder pin length [P]1.4 mm
Pin dimensions0.8 x 0.8 mm
PCB design
Hole diameter1.4 mm

Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles25
Insertion strength per pos. approx.8 N
Withdraw strength per pos. approx.6 N

Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions12
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions1012Ω
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 250
Rated insulation voltage (III/3)32 V
Rated surge voltage (III/3)1.5 kV
minimum clearance value - non-homogenous field (III/3)0.8 mm
minimum creepage distance (III/3)1.3 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)160 V
Rated surge voltage (II/2)1.5 kV
minimum clearance value - non-homogenous field (II/2)0.5 mm
minimum creepage distance (II/2)1.6 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Sweep speed5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R12 mΩ
Contact resistance R22.2 mΩ
Insertion/withdrawal cycles25
Climatic test
SpecificationISO 6988:1985-02
Corrosive stress0.2 dm3SO2on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Title: Size: Type:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes

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