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BPM-O-1200/12 111035 0002459487 EATON ELECTRIC Surface-mounted installation distribution board with double-b..
BPM-O-1200/12
111035
0002459487
EATON-MOELLER
Surface-mounted installation distribution board with double-bit lock, IP55, HxWxDHxWxD=1260x1200x270mm
Distribution boards > Small distribution board
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* Brand new product in its original packaging covered by the warranties and certifications provided by EATON-MOELLER
More info
▲Surface-mounted installation distribution board with double-bit lock, IP55, HxWxDHxWxD=1260x1200x270mm
EL-Nummer (Norway)
0002459487
IP55 surface-mounted service distribution board for damp locations, BPM-O-...Width 1200 mm, outside height 1260 mm, front plate height 1150 mm, depth 270 mm, welded enclosure with door and double-bit lock, earthed metal covers, extraordinary stability as a result of welded construction, well-structured, multilayered design for easily accessible installation, door can be right-hand or left-hand door, ample wiring area, open cable entry on top, prepared for F3A gland plate insert, variable interior fittings with or without removable mounting frame, indoor installation with MSW or mounting towers possible, if using an MSW assembly configuration, 2 pairs of BPZ-CTS-S corner towers and 1 BPZ-SNAP-MSW-CTS snap fitting element will be additionally required, if using a base frame assembly configuration, 2 BPZ-FPS front plate supports will be additionally required, gray, RAL 7035
Delivery program
Mounting type
Surface mounted
Material
Sheet steel
Door interlock
Double-ward lock
Installation site
Moisture-proof
Degree of Protection
IP55
Surface finish
With powder coating
Width
1200 mm
Depth
270 mm
Height
1260 mm
Colour
light gray (RAL 7035)
Design verification as per IEC/EN 61439
Technical data for design verification
Heat dissipation, at an ambient temperature of 35°C, delta T: 20 degrees in top of the enclosure, calculated as per IEC 60890Individual enclosure for wall mounting [PV]
191 W
Heat dissipation, at an ambient temperature of 35°C, delta T: 20 degrees in top of the enclosure, calculated as per IEC 60890Starting enclosure for wall mounting [PV]
183 W
Heat dissipation, at an ambient temperature of 35°C, delta T: 20 degrees in top of the enclosure, calculated as per IEC 60890Middle enclosure for wall mounting [PV]
177 W
Heat dissipation, at an ambient temperature of 35°C, delta T: 35 degrees in top of the enclosure, calculated as per IEC 60890Individual enclosure for wall mounting [PV]
383 W
Heat dissipation, at an ambient temperature of 35°C, delta T: 35 degrees in top of the enclosure, calculated as per IEC 60890Starting enclosure for wall mounting [PV]
367 W
Heat dissipation, at an ambient temperature of 35°C, delta T: 35 degrees in top of the enclosure, calculated as per IEC 60890Middle enclosure for wall mounting [PV]
356 W
IEC/EN 61439 design verification
10.2 Strength of materials and parts10.2.2 Corrosion resistance
Meets the product standard's requirements.
10.2 Strength of materials and parts10.2.3.1 Verification of thermal stability of enclosures
Meets the product standard's requirements.
10.2 Strength of materials and parts10.2.3.2 Verification of resistance of insulating materials to normal heat
Meets the product standard's requirements.
10.2 Strength of materials and parts10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects
Meets the product standard's requirements.
10.2 Strength of materials and parts10.2.4 Resistance to ultra-violet (UV) radiation
Not relevant to indoor installations.
10.2 Strength of materials and parts10.2.5 Lifting
Does not apply to enclosures without lifting aids.
10.2 Strength of materials and parts10.2.6 Mechanical impact
IK10
10.2 Strength of materials and parts10.2.7 Inscriptions
Meets the product standard's requirements.
10.3 Degree of protection of ASSEMBLIES
IP55
10.4 Clearances and creepage distances
Is the panel builder's responsibility.
10.5 Protection against electric shock
< 0.1 Ω; meets the product standard's requirements.
10.6 Incorporation of switching devices and components
Is the panel builder's responsibility.
10.7 Internal electrical circuits and connections
Is the panel builder's responsibility.
10.8 Connections for external conductors
Is the panel builder's responsibility.
10.9 Insulation properties10.9.2 Power-frequency electric strength
Ui = 440 V AC
10.9 Insulation properties10.9.3 Impulse withstand voltage
4 kV
10.9 Insulation properties10.9.4 Testing of enclosures made of insulating material
Does not apply to metal enclosures.
10.10 Temperature rise
The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
10.11 Short-circuit rating
Is the panel builder's responsibility.
10.12 Electromagnetic compatibility
Is the panel builder's responsibility.
10.13 Mechanical function
Meets the product standard's requirements.
Technical data ETIM 7.0
Distribution boards (EG000023) / Small distribution board (EC000214)
Electric engineering, automation, process control engineering / Electrical installation, device / Electrical distribution system (incl. small distribution board) / Small distribution board ([email protected] [ACN387011])
Mounting method
Surface mounted (plaster)
Number of rows
9
Width in number of modular spacings
57
Type of cover
Door
Cover model
Closed
Transparent cover/door
No
Material housing
Steel
Height
1260 mm
Width
1200 mm
Depth
270 mm
Built-in depth
0 mm
Internal depth
265 mm
DIN-rail
No
With mounting plate
No
Extension possible
Yes
EMC-version
No
Colour
Grey
RAL-number
7035
Degree of protection (IP)
IP55
With lock
No
Type of closure
Other
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOGUE EATON EN.pdf | 51 Mbytes |
|
| BPM-O-1200/12 0002459487 111035 111035.pdf | 138 Kbytes |
|
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