Technical data for design verification | | | |
Rated operational current for specified heat dissipation | In | A | 4000 |
Equipment heat dissipation, current-dependent | Pvid | W | 600 |
Operating ambient temperature min. | | °C | -25 |
Operating ambient temperature max. | | °C | 70 |
IEC/EN 61439 design verification | | | |
10.2 Strength of materials and parts | | | |
10.2.2 Corrosion resistance | | | Meets the product standard's requirements. |
10.2.3.1 Verification of thermal stability of enclosures | | | Meets the product standard's requirements. |
10.2.3.2 Verification of resistance of insulating materials to normal heat | | | Meets the product standard's requirements. |
10.2.3.3 Verification of resistance of insulating materials to abnormal heat and fire due to internal electric effects | | | Meets the product standard's requirements. |
10.2.4 Resistance to ultra-violet (UV) radiation | | | Meets the product standard's requirements. |
10.2.5 Lifting | | | Does not apply, since the entire switchgear needs to be evaluated. |
10.2.6 Mechanical impact | | | Does not apply, since the entire switchgear needs to be evaluated. |
10.2.7 Inscriptions | | | Meets the product standard's requirements. |
10.3 Degree of protection of ASSEMBLIES | | | Does not apply, since the entire switchgear needs to be evaluated. |
10.4 Clearances and creepage distances | | | Meets the product standard's requirements. |
10.5 Protection against electric shock | | | Does not apply, since the entire switchgear needs to be evaluated. |
10.6 Incorporation of switching devices and components | | | Does not apply, since the entire switchgear needs to be evaluated. |
10.7 Internal electrical circuits and connections | | | Is the panel builder's responsibility. |
10.8 Connections for external conductors | | | Is the panel builder's responsibility. |
10.9 Insulation properties | | | |
10.9.2 Power-frequency electric strength | | | Is the panel builder's responsibility. |
10.9.3 Impulse withstand voltage | | | Is the panel builder's responsibility. |
10.9.4 Testing of enclosures made of insulating material | | | Is the panel builder's responsibility. |
10.10 Temperature rise | | | The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices. |
10.11 Short-circuit rating | | | Is the panel builder's responsibility. The specifications for the switchgear must be observed. |
10.12 Electromagnetic compatibility | | | Is the panel builder's responsibility. The specifications for the switchgear must be observed. |
10.13 Mechanical function | | | The device meets the requirements, provided the information in the instruction leaflet (IL) is observed. |