10.10 Temperature rise
The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
10.11 Short-circuit rating
Is the panel builder's responsibility.
10.12 Electromagnetic compatibility
Is the panel builder's responsibility.
10.13 Mechanical function
The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.
10.2.2 Corrosion resistance
Meets the product standard's requirements.
10.2.3.1 Verification of thermal stability of enclosures
Meets the product standard's requirements.
10.2.3.2 Verification of resistance of insulating materials to normal heat
Meets the product standard's requirements.
10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects
Meets the product standard's requirements.
10.2.4 Resistance to ultra-violet (UV) radiation
10.2.5 Lifting
Does not apply to enclosures without lifting aids.
10.2.6 Mechanical impact
Does not apply, since the entire switchgear needs to be evaluated.
10.2.7 Inscriptions
Meets the product standard's requirements.
10.3 Degree of protection of assemblies
Meets the product standard's requirements.
10.4 Clearances and creepage distances
Meets the product standard's requirements.
10.5 Protection against electric shock
Is the panel builder's responsibility.
10.6 Incorporation of switching devices and components
Does not apply, since the entire switchgear needs to be evaluated.
10.7 Internal electrical circuits and connections
Is the panel builder's responsibility.
10.8 Connections for external conductors
Is the panel builder's responsibility.
10.9.2 Power-frequency electric strength
Is the panel builder's responsibility.
10.9.3 Impulse withstand voltage
Is the panel builder's responsibility.
10.9.4 Testing of enclosures made of insulating material
Is the panel builder's responsibility.
Fitted with:
Touch screen
Other storage media
Memory capacity (hard disc)
Number of buttons with LED
Number of free slots (AGP)
Number of free slots (ISA)
Number of free slots (Other)
Number of free slots (PCI)
Number of free slots (PCMCIA)
Number of function buttons
Degree of protection (front side)
Number of HW-interfaces (industrial ethernet)
Number of HW-interfaces (other)
Number of HW-interfaces (parallel)
Number of HW-interfaces (PS2)
Number of HW-interfaces (RS-232)
Number of HW-interfaces (RS-422)
Number of HW-interfaces (RS-485)
Number of HW-interfaces (SCSI)
Number of HW-interfaces (serial TTY)
Number of HW-interfaces (USB)
Number of HW-interfaces (wireless)
Number of interfaces (PROFINET)
Number of pixels (horizontal)
Number of pixels (vertical)
Number of storage media bays
Operating temperature - max
Operating temperature - min
Preinstalled operating system
Supply voltage at AC, 50 Hz - max
Supply voltage at AC, 50 Hz - min
Supply voltage at AC, 60 Hz - max
Supply voltage at AC, 60 Hz - min
Supply voltage at DC - max
Supply voltage at DC - min
Protocol
EtherNet/IP
MODBUS
Other bus systems