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SAMPLE PTSM 0,5/ 8-HH0-2,5SMDWH 1820709 PHOENIX CONTACT Sample set
SAMPLE PTSM 0,5/ 8-HH0-2,5SMDWH
1820709
PHOENIX_CONTACT
5
Sample set
Printed circuit board base housing, nominal section: 0.5 mm², color: white signals, nominal current: 6 A, nominal voltage (III/2): 160 V, contact surface: Tin, contact type: Male, number of potentials: 8, number of rows: 1, number of poles: 8, number of connections: 8, family of articles: PTSM 0.5/.. -HH-SMD WH, pitch: 2.5 mm, mounting: SMD soldering, pin arrangement: Linear pin arrangement, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Plug-in face orientation: Standard, locking: without, fixing type: without, packaging type: boxed
PCB headers, nominal cross section: 0.5 mm2, color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: PTSM 0,5/..-HH-SMD WH, pitch: 2.5 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
PCB Connectors (PCC)
Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT
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▲| Product type | PCB headers |
| Product family | PTSM 0,5/..-HH-SMD WH |
| Product line | COMBICON Connectors XS |
| Type | Standard |
| Number of positions | 8 |
| Pitch | 2.5 mm |
| Number of connections | 8 |
| Number of rows | 1 |
| Number of potentials | 8 |
| Mounting flange | without |
| Pin layout | Linear pad geometry |
| Solder pins per potential | 1 |
| Data management status | |
| Article revision | 00 |
| Nominal current IN | 6 A |
| Nominal voltage UN | 160 V |
| Contact resistance | 3 mΩ |
| Rated voltage (III/3) | 125 V |
| Rated surge voltage (III/3) | 2.5 kV |
| Rated voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| Rated voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| Mounting type | SMD soldering |
| Pin layout | Linear pad geometry |
| Processing notes | |
| Process | Reflow soldering |
| Moisture Sensitive Level | MSL 1 |
| Classification temperature Tc | 260 °C |
| Solder cycles in the reflow | 3 |
| Material data - contact | |
| Note | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Contact material | Cu alloy |
| Surface characteristics | Tin-plated |
| Metal surface contact area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface contact area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Metal surface soldering area (top layer) | Tin (3 - 5 µm Sn) |
| Metal surface soldering area (middle layer) | Nickel (1.3 - 3 µm Ni) |
| Material data - housing | |
| Color (Housing) | signal white (9003) |
| Insulating material | PA |
| Insulating material group | I |
| CTI according to IEC 60112 | 600 |
| Flammability rating according to UL 94 | V0 |
| Dimensional drawing |  |
| Pitch | 2.5 mm |
| Width [w] | 25.6 mm |
| Height [h] | 5 mm |
| Length [l] | 9.5 mm |
| Installed height | 5 mm |
| PCB design | |
| Pad geometry | 1.2 x 3.2 mm |
| Pin spacing | 2.50 mm |
| Visual inspection | |
| Specification | IEC 60512-1-1:2002-02 |
| Result | Test passed |
| Dimension check | |
| Specification | IEC 60512-1-2:2002-02 |
| Result | Test passed |
| Resistance of inscriptions | |
| Specification | IEC 60068-2-70:1995-12 |
| Result | Test passed |
| Polarization and coding | |
| Specification | IEC 60512-13-5:2006-02 |
| Result | Test passed |
| Contact holder in insert | |
| Specification | IEC 60512-15-1:2008-05 |
| Contact holder in insert Requirements >20 N | Test passed |
| Insertion and withdrawal forces | |
| Result | Test passed |
| No. of cycles | 10 |
| Insertion strength per pos. approx. | 5 N |
| Withdraw strength per pos. approx. | 4 N |
| Thermal test Test group C | |
| Specification | IEC 60512-5-1:2002-02 |
| Tested number of positions | 8 |
| Insulation resistance | |
| Specification | IEC 60512-3-1:2002-02 |
| Insulation resistance, neighboring positions | > 5 MΩ |
| Air clearances and creepage distances | |
| Specification | IEC 60664-1:2007-04 |
| Insulating material group | I |
| Comparative tracking index (IEC 60112) | CTI 600 |
| Rated insulation voltage (III/3) | 125 V |
| Rated surge voltage (III/3) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/3) | 1.5 mm |
| minimum creepage distance (III/3) | 1.9 mm |
| Rated insulation voltage (III/2) | 160 V |
| Rated surge voltage (III/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (III/2) | 1.5 mm |
| minimum creepage distance (III/2) | 1.5 mm |
| Rated insulation voltage (II/2) | 320 V |
| Rated surge voltage (II/2) | 2.5 kV |
| minimum clearance value - non-homogenous field (II/2) | 1.5 mm |
| minimum creepage distance (II/2) | 1.6 mm |
| Vibration test | |
| Specification | IEC 60068-2-6:2007-12 |
| Frequency | 10 - 150 - 10 Hz |
| Sweep speed | 1 octave/min |
| Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Test duration per axis | 2.5 h |
| Test directions | X-, Y- and Z-axis |
| Durability test | |
| Specification | IEC 60512-9-1:2010-03 |
| Impulse withstand voltage at sea level | 2.95 kV |
| Contact resistance R1 | 3 mΩ |
| Contact resistance R2 | 4 mΩ |
| Insertion/withdrawal cycles | 10 |
| Climatic test | |
| Specification | ISO 6988:1985-02 |
| Corrosive stress | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Thermal stress | 100 °C/168 h |
| Power-frequency withstand voltage | 1.39 kV |
| Ambient conditions | |
| Ambient temperature (operation) | -40 °C ... 100 °C (dependent on the derating curve) |
| Ambient temperature (storage/transport) | -40 °C ... 70 °C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 °C ... 100 °C |
| Type of packaging | packed in cardboard |
Datasheet - PDF
▲| Title: | Size: | Type: |
|---|---|---|
| PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf | 27 Mbytes |
|
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