SAMPLE MCV 0,5/ 3-G-2,54 SMD 1835875 PHOENIX CONTACT Sample set View larger
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SAMPLE MCV 0,5/ 3-G-2,54 SMD 1835875 PHOENIX CONTACT Sample set

SAMPLE MCV 0,5/ 3-G-2,54 SMD

1835875

PHOENIX_CONTACT

5

Sample set

Printed circuit board base housing, nominal section: 0.5 mm², color: black, nominal current: 6 A, nominal voltage (III/2): 160 V, contact surface: Gold, contact type: Male, number of potentials: 3, number of rows: 1, number of poles: 3, number of connections: 3, family of articles: MCV 0.5/.. -G-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin arrangement: Linear pin arrangement, pin length [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0.5, Plug-in face orientation: Standard, locking: without, fixing type: without, packaging type: boxed

PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MCV 0,5/..-G-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

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PCB Connectors (PCC)

Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT

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Technical data

Product properties
Product typePCB headers
Product familyMCV 0,5/..-G-SMD
Product lineCOMBICON Connectors XS
Number of positions3
Pitch2.54 mm
Number of connections3
Number of rows1
Number of potentials3
Mounting flangewithout
Pin layoutLinear pad geometry
Solder pins per potential1
Data management status
Article revision02

Electrical properties
Nominal current IN6 A
Nominal voltage UN160 V
Contact resistance2.6 mΩ
Rated voltage (III/3)32 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)160 V
Rated surge voltage (II/2)2.5 kV

Mounting
Mounting typeSMD soldering
Pin layoutLinear pad geometry
Processing notes
ProcessReflow soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc260 °C
Solder cycles in the reflow3

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsCompletely gold-plated
Metal surface contact area (top layer)Gold (0.25 Au)
Metal surface contact area (middle layer)Nickel (2 - 4 µm Ni)
Metal surface soldering area (top layer)Gold (0.25 Au)
Metal surface soldering area (middle layer)Nickel (2 - 4 µm Ni)
Material data - housing
Color (Housing)black (9005)
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0

Dimensions
Dimensional drawingdvbtjqggdc.jpg
Pitch2.54 mm
Width [w]12.2 mm
Height [h]4.85 mm
Length [l]7.1 mm
Installed height4.85 mm
Solder pin length [P]2 mm
Pin dimensions0.64 x 0.64 mm
PCB design
Pad geometry1.2 x 2.85 mm
Hole diameter1.2 mm

Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles100
Insertion strength per pos. approx.2 N
Withdraw strength per pos. approx.2 N

Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions16
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)32 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)1.5 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.6 mm
Rated insulation voltage (II/2)160 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)1.6 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 500 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 500 Hz)
Test duration per axis2 h
Test directionsX-, Y- and Z-axis (pos. and neg.)
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R12.6 mΩ
Contact resistance R22.6 mΩ
Insertion/withdrawal cycles100
Insulation resistance, neighboring positions> 5 MΩ
Climatic test
SpecificationDIN 50018:2013-05
Corrosive stress1.0 dm3SO2on 300 dm3/40 °C/3 cycles
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Title: Size: Type:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 27 Mbytes

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