MCD 1,5/10-G1F-3,81 GY 1717209 PHOENIX CONTACT Feed-through header View larger
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MCD 1,5/10-G1F-3,81 GY 1717209 PHOENIX CONTACT Feed-through header

MCD 1,5/10-G1F-3,81 GY

1717209

PHOENIX_CONTACT

50

Feed-through header

PCB base housing, nominal cross-section: 1.5 mm², colour: grey, nominal current: 8 A, nominal voltage (III/2): 160 V, surface contacts: Tin, contact type: Male, number of potentials: 20, number of rows: 2, number of poles: 10, number of connections: 20, article family: MCD 1.5/.. -G1F, pitch: 3.81 mm, mounting: Wave soldering, pin arrangement: Linear pin arrangement, pin length [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1.5, Plug-in face orientation: Standard, locking: Screw locking, fixing type: Overhead clamping (thread), packing type: boxed packaging

PCB headers, nominal cross section: 1.5 mm2, color: gray, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 20, number of rows: 2, number of positions: 10, number of connections: 20, product range: MCD 1,5/..-G1F, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: packed in cardboard

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Connectors > Printed circuit board connector

PCB Connectors (PCC)

* Brand new product in its original packaging covered by the warranties and certifications provided by PHOENIX_CONTACT

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50+$9.49
100+$8.80
150+$8.72
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Technical data

Product properties
Product lineCOMBICON Connectors S
Product typePCB headers
Product familyMCD 1,5/..-G1F
Number of positions10
Pitch3.81 mm
Number of connections20
Number of rows2
Number of potentials20
Pin layoutLinear pinning
Solder pins per potential1

Electrical properties
Nominal current IN8 A
Nominal voltage UN160 V
Degree of pollution3
Contact resistance1.2 mΩ
Rated voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
Rated voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
Rated voltage (II/2)320 V
Rated surge voltage (II/2)2.5 kV

Mounting
Mounting typeWave soldering
Pin layoutLinear pinning
Flange
Tightening torque0.3 Nm

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (1 - 3 µm Ni)
Material data - housing
Color (Housing)gray (7042)
Insulating materialPA
Insulating material groupI
CTI according to IEC 60112600
Flammability rating according to UL 94V0
Glow wire flammability index GWFI according to EN 60695-2-12850
Glow wire ignition temperature GWIT according to EN 60695-2-13775
Temperature for the ball pressure test according to EN 60695-10-2125 °C

Dimensions
Dimensional drawingfakawlzclm.jpg
Pitch3.81 mm
Width [w]48.49 mm
Height [h]26.2 mm
Length [l]21.9 mm
Installed height22.7 mm
Solder pin length [P]3.5 mm
Pin dimensions0.8 x 0.8 mm
PCB design
Pin spacing12.70 mm
Hole diameter1.2 mm

Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles25
Insertion strength per pos. approx.8 N
Withdraw strength per pos. approx.5 N

Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions16
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupI
Comparative tracking index (IEC 60112)CTI 600
Rated insulation voltage (III/3)160 V
Rated surge voltage (III/3)2.5 kV
minimum clearance value - non-homogenous field (III/3)1.5 mm
minimum creepage distance (III/3)2 mm
Rated insulation voltage (III/2)160 V
Rated surge voltage (III/2)2.5 kV
minimum clearance value - non-homogenous field (III/2)1.5 mm
minimum creepage distance (III/2)1.5 mm
Rated insulation voltage (II/2)320 V
Rated surge voltage (II/2)2.5 kV
minimum clearance value - non-homogenous field (II/2)1.5 mm
minimum creepage distance (II/2)1.6 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Sweep speed5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level2.95 kV
Contact resistance R11.2 mΩ
Contact resistance R21.3 mΩ
Contact resistance R22nd level2.2 mΩ
Insertion/withdrawal cycles25
Insulation resistance, neighboring positions> 5 MΩ
Climatic test
SpecificationISO 6988:1985-02
Corrosive stress0.2 dm3SO2on 300 dm3/40 °C/1 cycle
Thermal stress100 °C/168  h
Power-frequency withstand voltage1.39 kV
Shocks
SpecificationIEC 60068-2-27:2008-02
Pulse shapeHalf-sine
Acceleration30g
Shock duration18 ms
Test directionsX-, Y- and Z-axis (pos. and neg.)
Ambient conditions
Ambient temperature (operation)-40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Type of packagingpacked in cardboard

Datasheet - PDF

Title: Size: Type:
PDF CATALOG PHOENIX PCB CONNECTORS EN.pdf 15 Mbytes

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