CCV 2,5/ 5-GF-5,08 P26THRR56 1955772 PHOENIX CONTACT Printed-circuit board connector View larger
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CCV 2,5/ 5-GF-5,08 P26THRR56 1955772 PHOENIX CONTACT Printed-circuit board connector

CCV 2,5/ 5-GF-5,08 P26THRR56

1955772

PHOENIX_CONTACT

140

Printed-circuit board connector

Printed circuit board base case, nominal section: 2.5 mm², color: black, nominal current: 12 A, nominal voltage (III/2): 320 V, contact surface: Tin, contact type: Male, number of potentials: 5, number of rows: 1, number of poles: 5, number of connections: 5, family of articles: CCV 2.5/.. -GF, pitch: 5.08 mm, mounting: Solder THR, pin arrangement: Linear pin arrangement, pin length [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2.5, Plug-in face orientation: Standard, lock: Screw lock, fixing type: Air clamping (thread), packaging type: 56 mm wide strap, Further user information and design recommendations for Through Hole Reflow technology can be found at: Downloads

PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: 56 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads

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PCB Connectors (PCC)

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Technical data

Product properties
Product typePCB headers
Product familyCCV 2,5/..-GF
Product lineCOMBICON Connectors M
TypeComponent suitable for through hole reflow
Number of positions5
Pitch5.08 mm
Number of connections5
Number of rows1
Number of potentials5
Mounting flangeThreaded flange
Pin layoutLinear pinning
Solder pins per potential1
Data management status
Article revision07

Electrical properties
Nominal current IN12 A
Nominal voltage UN320 V
Contact resistance1 mΩ
Rated voltage (III/3)250 V
Rated surge voltage (III/3)4 kV
Rated voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
Rated voltage (II/2)400 V
Rated surge voltage (II/2)4 kV

Mounting
Mounting typeTHR soldering / wave soldering
Pin layoutLinear pinning
Flange
Tightening torque0.3 Nm
Processing notes
ProcessReflow/wave soldering
Moisture Sensitive LevelMSL 1
Classification temperature Tc260 °C
Solder cycles in the reflow3

Material specifications
Material data - contact
NoteWEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact materialCu alloy
Surface characteristicsTin-plated
Metal surface contact area (top layer)Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer)Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer)Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer)Nickel (1.3 - 3 µm Ni)
Material data - housing
Color (Housing)black (9005)
Insulating materialLCP
Insulating material groupIIIa
CTI according to IEC 60112175
Flammability rating according to UL 94V0

Notes
Details for soldering processesProcessing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)
Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C

Dimensions
Dimensional drawingdvbtjqggdc.jpg
Pitch5.08 mm
Width [w]35.51 mm
Height [h]14.6 mm
Length [l]8.57 mm
Installed height12 mm
Solder pin length [P]2.6 mm
Pin dimensions1 x 1 mm
PCB design
Hole diameter1.6 mm

Mechanical tests
Visual inspection
SpecificationIEC 60512-1-1:2002-02
ResultTest passed
Dimension check
SpecificationIEC 60512-1-2:2002-02
ResultTest passed
Resistance of inscriptions
SpecificationIEC 60068-2-70:1995-12
ResultTest passed
Polarization and coding
SpecificationIEC 60512-13-5:2006-02
ResultTest passed
Contact holder in insert
SpecificationIEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N
Test passed
Insertion and withdrawal forces
ResultTest passed
No. of cycles25
Insertion strength per pos. approx.8 N
Withdraw strength per pos. approx.6 N

Electrical tests
Thermal test Test group C
SpecificationIEC 60512-5-1:2002-02
Tested number of positions12
Insulation resistance
SpecificationIEC 60512-3-1:2002-02
Insulation resistance, neighboring positions> 5 MΩ
Air clearances and creepage distances
SpecificationIEC 60664-1:2007-04
Insulating material groupIIIa
Comparative tracking index (IEC 60112)CTI 175
Rated insulation voltage (III/3)250 V
Rated surge voltage (III/3)4 kV
minimum clearance value - non-homogenous field (III/3)3 mm
minimum creepage distance (III/3)4 mm
Rated insulation voltage (III/2)320 V
Rated surge voltage (III/2)4 kV
minimum clearance value - non-homogenous field (III/2)3 mm
minimum creepage distance (III/2)3.2 mm
Rated insulation voltage (II/2)400 V
Rated surge voltage (II/2)4 kV
minimum clearance value - non-homogenous field (II/2)3 mm
minimum creepage distance (II/2)4 mm

Environmental and real-life conditions
Vibration test
SpecificationIEC 60068-2-6:2007-12
Frequency10 - 150 - 10 Hz
Sweep speed1 octave/min
Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Acceleration5g (60.1 Hz ... 150 Hz)
Test duration per axis2.5 h
Test directionsX-, Y- and Z-axis
Durability test
SpecificationIEC 60512-9-1:2010-03
Impulse withstand voltage at sea level4.8 kV
Contact resistance R11 mΩ
Contact resistance R21 mΩ
Insertion/withdrawal cycles25
Insulation resistance, neighboring positions> 5 MΩ
Climatic test
SpecificationISO 6988:1985-02
Corrosive stress0.2 dm3SO2on 300 dm3/40 °C/1 cycle
Thermal stress105 °C/168 h
Power-frequency withstand voltage2.21 kV
Shocks
SpecificationIEC 60068-2-27:2008-02
Pulse shapeSemi-sinusoidal
Acceleration30g
Shock duration18 ms
Test directionsX-, Y- and Z-axis (pos. and neg.)
Ambient conditions
Ambient temperature (operation)-40 °C ... 105 °C (dependent on the derating curve)
Ambient temperature (storage/transport)-40 °C ... 70 °C
Relative humidity (storage/transport)30 % ... 70 %
Ambient temperature (assembly)-5 °C ... 100 °C

Packaging specifications
Dimensional drawingckrmjeflhr.jpg
Type of packaging56 mm wide tape
[W] tape width56 mm
[W2] coil overall dimension62.4 mm
[A] coil diameter330 mm
Outer packaging typeTransparent-Bag
ESD level(D) electrostatically conductive
SpecificationDIN EN 61340-5-1 (VDE 0300-5-1): 2008-07

Datasheet - PDF

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