Product name
Eaton XC Compact PLC
Product Length/Depth
50.6 millimetre
Product height
102.6 millimetre
Product width
155 millimetre
Product weight
0.29 kilogram
Certifications
UL Category Control No.: NRAQ
CSA Class No.: none
CULus
CE
UL 508
EN 61131
UL File No.: E205091
DNV GL
UL
IEC/EN 61131-2, CE
UL508
CSA File No.: UL report applies to both US and Canada
Certified by UL for use in Canada
Catalog Notes
CoDeSys Runtime (license inclusive)
Features
Integrated Web server
Fitted with:
Libraries
Engineering software
Visualization
Documentation
Programming interface
Real time clock
Basic device
Power supply
Communication module
Technology module
Memory unit
Function module
Other components
Functions
Building blocks
Web-server
Additional field bus interfaces
OPC Server
Remote Server
Processor
RISC CPU, 32 Bit, 400 MHz
Battery runtime
10 years typ.
Memory capacity
64 MegaByte/4 kByte/32 kByte (Application/marker/retain data)
Operating system
Windows CE 5.0 (license included)
Rated operational voltage
20.4 - 28.8 V DC
Supply voltage at DC - max
24
Climatic environmental conditions
Ambient operating temperature - min
0 °C
Ambient operating temperature - max
55 °C
Ambient storage temperature - min
-20 °C
Ambient storage temperature - max
60 °C
Connection to SmartWire-DT
No
Connection type
Ethernet: RJ45 plug, 8-pole
CAN: 9-pole SUB-D (plug)
RS232: SUB-D, 9-pole (plug)
Cycle time
< 0.04 ms, for 1 k of instructions (Bit, Byte), memory
Data transfer rate
1000 kBit/s, CAN
57.6 kBit/s, RS232
57.6 kBit/s, RS485
100Base-TX, Ethernet
10Base-T, Ethernet
Interfaces
RS232
1 x USB host 2.0 (built-in)
USB 2.0
1 x RS485 (built-in)
1 x CANopen®/easyNet (built-in)
CAN
1 x RS232 (built-in)
1 x Ethernet 10/100 Mbps (built-in)
1 x USB device 2.0 (built-in)
USB 2.0 (Host)
Memory
64 MByte Program memory code
Number of modules
127 (CAN)
Number of slots
1 (for SD-Card)
Protocol
UDP (basic interface)
TCP (basic interface)
FTP (basic interface)
HTTP (basic interface)
IP (basic interface)
CANopen® (additional interface)
SMTP (basic interface)
easyNet - Master/Device (additional interface)
Equipment heat dissipation, current-dependent Pvid
0 W
Heat dissipation capacity Pdiss
0 W
Heat dissipation per pole, current-dependent Pvid
0 W
Rated operational current for specified heat dissipation (In)
0 A
Static heat dissipation, non-current-dependent Pvs
6 W
Heat dissipation details
6 W for basic device + 2.5 W for USB module
With power consumption for 24 V
10.2.2 Corrosion resistance
Meets the product standard's requirements.
10.2.3.1 Verification of thermal stability of enclosures
Meets the product standard's requirements.
10.2.3.2 Verification of resistance of insulating materials to normal heat
Meets the product standard's requirements.
10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects
Meets the product standard's requirements.
10.2.4 Resistance to ultra-violet (UV) radiation
Meets the product standard's requirements.
10.2.5 Lifting
Does not apply, since the entire switchgear needs to be evaluated.
10.2.6 Mechanical impact
Does not apply, since the entire switchgear needs to be evaluated.
10.2.7 Inscriptions
Meets the product standard's requirements.
10.3 Degree of protection of assemblies
Meets the product standard's requirements.
10.4 Clearances and creepage distances
Meets the product standard's requirements.
10.5 Protection against electric shock
Does not apply, since the entire switchgear needs to be evaluated.
10.6 Incorporation of switching devices and components
Does not apply, since the entire switchgear needs to be evaluated.
10.7 Internal electrical circuits and connections
Is the panel builder's responsibility.
10.8 Connections for external conductors
Is the panel builder's responsibility.
10.9.2 Power-frequency electric strength
Is the panel builder's responsibility.
10.9.3 Impulse withstand voltage
Is the panel builder's responsibility.
10.9.4 Testing of enclosures made of insulating material
Is the panel builder's responsibility.
10.10 Temperature rise
The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.
10.11 Short-circuit rating
Is the panel builder's responsibility.
10.12 Electromagnetic compatibility
Is the panel builder's responsibility.
10.13 Mechanical function
The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.